Ansys Learning Forum › Forums › Discuss Simulation › General Mechanical › Frictional vibrations in the wafer surface cleaning process. › Reply To: Frictional vibrations in the wafer surface cleaning process.
March 6, 2024 at 7:45 am
Forum Moderator
Hi,
How are the 5 parts on the grinding wheel connected? Are they sharing topology? Also, what is the error message you see? If you can share snapshots of solver output then it may help to comment further.
Regards,
Ashish Khemka