Ansys Learning Forum › Forums › Discuss Simulation › Electronics › Modelling PCB warpage in Ansys Spaceclaim and Mechanical › Reply To: Modelling PCB warpage in Ansys Spaceclaim and Mechanical
		
		
				
		
		
		
		
		
		
		
			June 30, 2021 at 5:53 am		
	
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		I came up with a third boundary condition setup as follows:
Create a large plane geometry for the PCB to sit on
Place fixed support on the plane geometry (for the purpose of simulating the "ground" in a reflow oven)
Set a rough (or maybe frictionless?) contact between the ground plane and PCB (To allow a gap to form when the PCB bends)
However, this setup unfortunately did not converge when I tried running it. Any suggestion for improvement is appreciated!
		
		
	
Create a large plane geometry for the PCB to sit on
Place fixed support on the plane geometry (for the purpose of simulating the "ground" in a reflow oven)
Set a rough (or maybe frictionless?) contact between the ground plane and PCB (To allow a gap to form when the PCB bends)
However, this setup unfortunately did not converge when I tried running it. Any suggestion for improvement is appreciated!

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