Ansys Assistant will be unavailable on the Learning Forum starting January 30. An upgraded version is coming soon. We apologize for any inconvenience and appreciate your patience. Stay tuned for updates.

Innovation Space

FREE STUDENT SOFTWARE

Case studies on thermal-stress simulation for multi-die 2.5D packaging

- April 25, 2026 at 9:14 am
  
  pangzw3
  Subscriber
  
  Our project is currently exploring the impact of packaging simulation on multi-die (including sensors and ASIC chips). We would like to see how various parameters of the chips and sensors change after thermal-stress simulation. Are there any relevant case studies on 2.5D multi-die packaging simulation available?

Viewing 0 reply threads

You must be logged in to reply to this topic.

[bingo_chatbox]