Electronics

Electronics

Topics related to HFSS, Maxwell, SIwave, Icepak, Electronics Enterprise and more.

How assign the thermal resistance correctly in AEDT Icepak

    • vishalgnair1812
      Subscriber

      I have a QFN package cad model made in solidworks. The die is disspating heat of 100 W and the junction to case resistance is 0.5 °C/W. I tried assigning the top surface of die and bottom surface of thermal pad as network model and gave the thermal resistance. But, everytime I do that the solution divereges. What can be the solution for this problem and if anyone could share a how a network model will be it could be helpful.

      Thank you

    • Rabindra Paul
      Ansys Employee

      Hi Vishal: Thanks for using Forum to ask question. You may review workshop 1 for AEDT Icepak Introductory training material for the steps to create 2-R network. Please make sure: Network block have Solve Inside turned off
      ‐ Make sure ‘Solve Inside’ option is turned off for the Die object which you are modeling as a network. 

      However, solution divergence could have for many other reasons.

       

      Hope this is of help.

       

      Regards,

       

      Rabindra

    • vishalgnair1812
      Subscriber

      Hi Rabindra. Thank you for the suggestion, I was previously missing out on the solve inside has to be unchecked.

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