Learning Forum

[tcs engineer]

Dear members,

I am trying to do thermal analysis of electronic card/board using Ansys fluent.

I come across thermal conductivity in-plane and out-plane. 

Please can any one explain me which is the best approach to consider.

If you say its orthotropic can any one give me some explanation on an-isotropic and orthotropic 

 

Regards,

VIJAY B R 

[peteroznewman]

Hello Vijay,

If you have conductivity data for the PCB material in different directions, then you can use that. Say the thickness of the PCB is in the Z direction, and say the conductivity is much lower through the thickness than along the plane, then you would create an orthtropic material.

If you don't have any directional data, then you have to use an isotropic material and the conductivity is no different through the thickness than in-plane.

Note: I just made up these numbers to illustrate the concept.
You have to find some actual data for the material you are using.

Regards,

Peter

[tcs engineer]

Thank you Peter, 

its a good solution,

And I have done in this way defining in fluent material section,

do you accept this? if not please give a reason.

 

 

[peteroznewman]

Looks good.

[Rob]

If you click on the Help button in R19.x and follow the links it'll give you some more information: you've got it right though assuming you got the directions correct. 

[tcs engineer]

Thank you for the solution, 

i request you to comment on my another problem post.

Regards,

VIJAY B R,