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March 8, 2023 at 11:32 pm
Yang Li
SubscriberI want use SI Wave DCIR simulate PCB trace DC Resistance. On the PCB, some layers conductive meterial is 1 Oz copper. And at top/bottom layer, there will be 2um gold plating. At Layer stackup editor, I only can assign one material each layer. How to add gold plating to simulation?
Second question: I also need calcualte trace capacitance reference to GND(Let's say if I can ignore the other traces factors). Under DC tap-there is compute inductance, but I couldn't find compute capacitance option. If I want compute capacitance, what is the best way?Â
The last question: Does SI Wave use 2.5D solver DCIR simulation?Â
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May 5, 2023 at 6:01 am
Mrinmoy Bharadwaj
Ansys EmployeeQuestion1, Response: You can use "overlapping" instead of "Laminate" stack-up option inside HFSS 3D Layout to construct a plating on your top and bottom layers.
Question2, Response: For extracting RLGC you can use the CPA solver inside SIwave and use the Q3D solver.
Question3, Resposne: SIwave uses both 2D solvers and 3D solvers as per requirement.
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