Learning Forum

[bb123.kim]

I'm doing a simulation and I'm worried about modeling the display.

The display has many layers that are very thin.

Some layers are soft enough to consider thickness changes, so I don't use shells (shells are ignoring thickness direction changes, as I know) , so I am modeling each layer as solid but I think it might be very inefficient.  So what I read recently is t-shell and composite materials , can this help? Is there any documents or data I can get related to? And the printed circuit board (PCB) is also being modeled as a solid mesh, so I'm considering using t-shell for this as well.

I am usually doing drop or steel-ball drop simulation.

And I'm not looking for damage to the display itself, but I'm interested in damage to the components below the display.

Apart from t-shell, please share if you have any good suggestions for this kind of modeling.

[Ram Gopisetti]

Hi, you can use the Tshells to model the PCB with atleast 3 or more elements through its thickness, "damages" like erosion or the sum of plastic strain of failure as in Material cards. 

Cheers, Ram 

 

[Andreas Koutras]

Here is the remark from the manual on the different tshell formulation.