AI・HPCシステムの高性能化に伴い、CPO（Co-Packaged Optics）は次世代インターコネクト技術として注目されています。
本ウェビナーでは、LumericalによるPIC変調器・光回路設計と、HFSSおよびAEDTによるシグナルインテグリティ解析を紹介します。さらに、光回路と電気回路を連成解析することで実現するシステムレベルの性能評価と最適化の重要性について説明します。
【申込受付終了日時】
2026/08/19(水) 16:00
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