Overview

Join us for an in-depth exploration of Ansys Sherlock 2025 R1’s latest capabilities and highlights around electronics reliability and Ansys Mechanical.

This latest update enhances your ability to predict the reliability of electronic components using advanced thermal-mech life predictions for BGA packages. Using an FEA-based approach, this new workflow helps account for system-level effects and additional behaviors, providing further insights into solder joint fatigue studies. This release also includes PySherlock updates with new APIs and automation capabilities. You will also benefit from general performance enhancements that refine the user experience and boost simulation efficiency.

What attendees will learn

• Thermal-Mech Life Predictions for BGA Packages
• PySherlock Updates
• Sherlock-Workbench and Sherlock Performance Enhancements

Who should attend

PCB Designers, Reliability Engineers, Mechanical Engineers, Thermal Engineers, PCB Reliability Engineers