Overview

This Ansys 2024 R1 webinar will review the high-frequency electronics tool updates, enhancements, and new features – HFSS, Q3D, SIwave, and NuHertz. Engineers developing PCBs, antennas, and other RF capabilities for telecommunications, HPC, automotive, A&D, and IoT applications will find many new capabilities and improvements in this update.

What you will learn

• Encrypted technology file support in HFSS 3D Layout IC Mode
• Enhanced support for FlexPCB in HFSS 3D
• HFSS Finite Array metadata export and mask automation
• Icepak Thermal Mesh Fusion
• Solver enhancements for SIwave and Q3D
• Improvements to HPC/Distributed Computing support for all products

Who should attend and why

Engineers involved in new product development for any electronics market

Speaker

• Juliano Mologni