Overview

The 2024 R1 release includes updates, enhancements, and new features for both Ansys Icepak and Ansys Mechanical Thermal. Those new capabilities include breakthrough functions that considerably impact engineers developing products in markets such as HPC, Automotive, A&D, and Consumer Electronics.

What you will learn

• Thermal Mesh Fusion for Icepak
• New GPU solver for Icepak
• Transient thermal solver for Mechanical Thermal
• Introduction of Thermal & Structural Layout Components with Trace Mapping in Mechanical Thermal

Who should attend and why

Engineers involved in hardware design for Automotive, A&D, Consumer Electronics and RF.

Speaker

• Jeff Tharp