本セミナーでは、先端パッケージ技術に対するAnsysソリューションの活用事例と可能性を紹介し、半導体業界における設計・解析・製造の課題解決に向けた新たなアプローチを共有します。特にAdvanced PackageにおけるSIPI解析、熱解析を用いた統合システム設計に焦点を当てます。また材料データ管理、製造工程に対するソリューションについても紹介します。
概要
お申し込み期限 2025年9月18日17:00
Upon successful completion of a course you can obtain a corresponding badge to document your achievement. This badge is issued from our partner Credly and can be shared through various networking channels.
If you would like to receive a course completion badge for this course please confirm below. Badges are issued within an hour of completing the course.
Thank you for requesting this course completion badge.
Upon successful completion of this course you should receive an email within an hour from Credly to accept the badge.
Thank you for your interest in Ansys Certifications. Once you confirm, you’ll receive an email within 1 hour containing your activation link. This link will grant you access to your certification for the duration specified in the product description.
Upon successfully completing your certification, you’ll earn an exclusive digital badge to officially document your achievement. This badge is your personal credential to showcase your skills and share your success on professional profiles, social media, and other networking platforms.
Unlock exclusive content and elevate your experience with our premium subscription. Get access now for an unparalleled level of benefits and enjoyment!
Our Learning products are not available for purchase in your region. Please check back soon. In meantime, please feel free to enroll in our free courses.
