伝送スピードの高速化や部品の高密度実装化により、コンポーネントと基板やコンポーネント間の電磁界結合の影響を考慮して解析したいニーズが年々増えています。実際に、これら影響を考慮して解析する場合、コンポーネントのモデルを入手する必要があります。本webinerでは、コンポーネントの内部構造や材料特性の秘匿性を保つことができる、暗号化された3次元モデルによるライブラリの共有方法についてご紹介いたします。
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初級～中級
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