The underfill process in electronic packaging plays a critical role in enhancing the reliability and performance of microelectronic devices. As electronic components continue to shrink in size and increase in complexity, the need for efficient underfill materials and reliable manufacturing processes becomes more pronounced. Computational Fluid Dynamics (CFD) analysis can be used as a powerful tool in understanding and optimizing the underfill process.

This workshop will teach you how to use Ansys Fluent for preparing and performing underfill simulations. Multiple strategies can be employed with varying degrees of complexity depending on the overall simulation objectives.

Learning Outcomes:

Following completion of this workshop, you will be able to:

• Simulate underfill process in Ansys Fluent.
• Understand domain and mesh requirements for underfill modeling.
• Setup simulation using VOF multiphase model.
• Use different strategies to simplify the model.
• Employ sliding mesh option to simulate nozzle motion.
• Setup and generate solution animations.

Prerequisites: 

• Previous experience using and applying the Ansys Fluent CFD solver is recommended.
• Previous training is recommended in the following areas:
  • Ansys Fluent Beyond the Basics.
  • Ansys Fluent Meshing with Watertight Geometry Workflow.
  • Ansys Fluent Multiphase Flow Modeling: Introduction and Volume of Fluid Model.

Please note: These training materials were developed and tested in the 2023R2 release