This course demonstrates how to import, organize, and simplify system-level MCAD geometry in Ansys Discovery™ 3D product simulation software and translate it into Ansys Icepak® electronics cooling simulation software native geometry. You will learn to prepare complex electronic assemblies for thermal simulation by identifying, excluding, and simplifying components for efficient meshing and analysis.
Learning Outcomes:
Following completion of this tutorial, you will be able to:
- Open and navigate Ansys Icepak software project with a detailed IC package.
- Import CTM-based power maps onto a die surface.
- Configure mesh regions for CTM models.
- Run system-level thermal simulations in Ansys Icepak software.
- Export monitor data for Synopsys RedHawk-SC Electrothermal software back annotation.
- Post-process simulation results for thermal visualization.
Please note: These training materials were developed and tested in the 2025R1 release.
