This course focuses on the dynamic thermal management of 2.5D ICs using thermostat-based power source control in Ansys Icepak® electronics cooling simulation software. The course is designed to help you understand how to simulate transient thermal behavior in devices that require frequency/power modulation to prevent overheating or maintain optimal performance.
Learning Outcomes:
Following completion of this tutorial, you will be able to:
- Grasp the principles of dynamic thermal management and the capabilities of Ansys Icepak software to simulate these scenarios.
- Effectively set up and utilize the DTM toolkit for transient thermal simulations.
- Analyze and interpret simulation results, including temperature and heat flow rate data, and export data for further processing.
Please note: These training materials were developed and tested in the 2025R1 release.
