Ansys Electronics Desktop 2025 R2 では、AI技術を活用したバーチャルアシスタントが実装されました。また、全ての Electronics 3D 製品が Ansys Cloud Burst に対応し、クラウド解析が可能になっています。
HFSSはMesh Fusion利用時の3D Componentの包含機能に対応しました。また、アレイアンテナ構成時に異なるサイズのユニットセルに対応しました。SBR+ではSBR+ Regionを含んだソースデザインのFar Field Linkに対応しました。
HFSS 3D LayoutはIPC-2581形式でのExportやMesh Fusion領域を跨いだPin GroupとCircuit Portの設定に対応しました。
IC ModeではPrismソルバーを使用したPI解析に対応しました。
申込受付終了日時 2025/09/18(木) 16:00
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