Application Field: ADAS and Autonomous Driving

Automotive designers, however, must still adhere to the size and packaging constraints to ensure vehicle size and weight does not increase. Because of this, there has been a push to make electronic components and packages smaller, while increasing performance.

One example of a company facing these demands is Continental Automotive, who designs and manufactures printed circuit board assemblies (PCBAs) for automotive electrification and autonomous vehicle applications. They have seen increased use of ball grid array (BGA) components and high-density interconnect (HDI) FR4 boards in their PCBAs, where components are tightly placed on both sides of the PCB to ensure the most efficient use of the board space.

When manufacturing PCBAs that are required to perform in various extreme field conditions, it is critically important to ensure reliability by understanding how different designs can affect solder fatigue. Each variable must be tested to determine what influence it has on solder fatigue, and thus, reliability of the board. This webinar spotlights how Continental Automotive has used Ansys Sherlock, Ansys Icepak and Ansys Workbench to predict solder fatigue due to system-level effects such as thermomechanical, shock and vibration influences early in the design process.

Speaker: Tony A. Asghari - Principal Staff Engineer, Quality and Reliability Physics Team Continental Automotive