Overview

The Ansys team has fine-tuned the ECAD integration into Maxwell from the previous release to enable first-time simulations on flex PCBs. The Shell Element and Nonlinear Resistive Thin Layer (NRTL) modeling enhances accuracy and reduces the simulation time on EM designs for which the
geometries exhibit high aspect ratios and demand greater accuracy.

• ECAD Integration Enhancements – The Phi-Plus Mesh feature enables low-frequency EM simulations for ECAD and MCAD assemblies with parallel meshing over multiple domains, resulting in a 10-fold decrease in simulation time.
• Shell Element Modeling – Shell elements are used in FEA to analyze EM effects in thin structures and components accurately. The modeling reduces the total computation time and improves the accuracy of the EM field computation on magnetic shielding and EMI/EMC.
• Nonlinear Resistive Thin Layer Modeling – This type of resistive modeling can model materials or interfaces with nonlinear resistive behavior. In EM simulations, resistive boundaries can represent materials that exhibit nonlinear conductivity. You can now obtain the nonlinear resistive behavior using the electric conductivity and current
  density.

What you will learn

• ECAD enhancements provide superior design robustness to flex and rigid PCBs
• Additional ECAD benefits include increased accuracy on the ECAD-MCAD assemblies, improved design predictability, and faster time-to-market
• The Shell Elements Modeling increases accuracy in analyzing thermal and EM coupling on EM heating and the analysis of coil windings and inductors with thin conductive layers
• The NRTL modeling increases simulation reliability in power electronic applications and reduces total computation time while increasing the accuracy of EM simulations

Who should attend and why

PCB Designers, Consumer Electronics Engineers, Systems Engineers, Power Solutions Engineers, SI/PI Engineers, Product Design Engineers, Power Module Engineers, and more.

Speaker

• Marius Rosu