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Which of the following boundary conditions are only applicable to a “thermal and conductive” HEAT simulation?
The time step used in transient simulations by the HEAT solver is constant during the entire simulation.
The “boundaries” dataset returned by the HEAT solver includes the current passing through voltage boundary conditions only when a “thermal and conductive” HEAT simulation is performed.
Which of the following can cause a transient HEAT simulation to diverge?
In the simulation of the heated wire performed in thermal-conductive simulation, imagine that all the surfaces of the glass encapsulation are thermally insulated except the top surface which is kept at 250 K by a thermoelectric cooler. Also, assume that the wire has a cross-section of 2 by 2 um.
What is the temperature of the hottest point in the simulation (in the units of kelvin) when a voltage of 2V is applied to the wire? (Hint: Use the visualizer window to view the temperature profile and its range)
Enter your answer as an integer number
Which of the following determines the end time of a transient HEAT simulation?
In the transient heat flow simulation of a glass thin-film with a graphene layer as performed in the “transient simulation” subsection, the right edge of the film is kept at 400K up to 200us.
If the right edge of the thin film is suddenly brought back from 400K to room temperature at 200us, from the moment that this change happens, how long does it take for the temperature difference across the entire thin film to become less than one degree?
Enter your answer in the units of us rounded to the nearest integer value.