Theoretical Development of Stress Analysis Model — Lesson 3

This lesson covers the concept of stress analysis in ultra-soft pulse laser heating processes. It delves into the differences between this model and conventional laser rolling processes. The lesson explains how the deformation behavior of thin metallic films can be analyzed using two temperature and hot electron blast models. It also discusses the effects of dynamic thermal elasticity and temperature gradient in metal lattice. The lesson further explores the impact of thermal contact resistance in multi-layer films and the influence of mechanical constraints on stress and distortion fields. It concludes by highlighting the need to consider thermal fatigue in cyclic loading conditions for reliable process modeling.

Video Highlights

01:05 - How the stress analysis model differs from conventional laser rolling processes
04:48 - How the dynamic thermoelasticity model considers the effects of inertia
16:08 - Analyzing Stress Field
19:32 - Stress field can be analyzed in the presence of thermal contact resistance

Key Takeaways

- The stress analysis model in ultra-soft pulse laser heating processes differs from conventional laser rolling processes.
- The deformation behavior of thin metallic films can be analyzed using two temperature and hot electron blast models.
- Dynamic thermal elasticity and temperature gradient in metal lattice play significant roles in these processes.
- Thermal contact resistance in multi-layer films can significantly impact temperature distribution.
- Mechanical constraints greatly influence stress and distortion fields.
- Considering thermal fatigue in cyclic loading conditions is crucial for reliable process modeling.