{"id":182166,"date":"2024-05-05T07:34:15","date_gmt":"2024-05-05T07:34:15","guid":{"rendered":"\/knowledge\/?post_type=topic&#038;p=182166"},"modified":"2024-05-05T09:39:49","modified_gmt":"2024-05-05T09:39:49","slug":"parametric-analysis-in-heat-sink-with-two-cpus-using-ansys-discovery","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/parametric-analysis-in-heat-sink-with-two-cpus-using-ansys-discovery\/","title":{"rendered":"Parametric Analysis in Heat sink with two CPUs using Ansys Discovery"},"content":{"rendered":"<div style=\"display: flex;\"><a class=\"discovery-attachments\" href=\"https:\/\/ansys13.ansys.com\/KnowledgeArticles\/Discovery\/AER_Discovery\/Parametric%20Analysis%20of%20HS\/Parametric%20Analysis%20in%20Heat%20sink%20with%20two%20CPUs%20using%20Ansys%20Discovery.pdf\"> <i class=\"fa fa-file-pdf-o\" aria-hidden=\"true\"> <\/i> Parametric Analysis<\/a><\/div>\n<p>In this article we will explore parametric analysis capabilities of Discovery where we will see how changing the flow speed influences lowering the temperature of CPUs for intense computations.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-182167 size-medium\" src=\"\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/05\/CHT-300x256.png\" alt=\"\" width=\"300\" height=\"256\" srcset=\"https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/05\/CHT-300x256.png 300w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/05\/CHT-24x20.png 24w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/05\/CHT-36x31.png 36w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/05\/CHT-48x41.png 48w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/05\/CHT.png 677w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/p>\n<p>&nbsp;<\/p>\n<p>Refer the attached document and <a href=\"https:\/\/ansys13.ansys.com\/KnowledgeArticles\/Discovery\/AER_Discovery\/Parametric%20Analysis%20of%20HS\/Heat_Sink_parametric_analysis.zip&quot;\">Simulation files <\/a> which demonstrates the need of Conjugate heat transfer analysis to correctly capture the uneven temperature gradient and use parametric capabilities to automatically test several simulation variations back-to-back.<\/p>\n","protected":false},"template":"","class_list":["post-182166","topic","type-topic","status-publish","hentry","topic-tag-3d-design","topic-tag-air","topic-tag-ansys-discovery","topic-tag-conductivity","topic-tag-conjugate-heat-transfer","topic-tag-cpu","topic-tag-design-points-chart","topic-tag-design-variations","topic-tag-discovery-explore","topic-tag-flow-speed","topic-tag-heat-sink","topic-tag-materials","topic-tag-monitors","topic-tag-parameters","topic-tag-parametric-analysis","topic-tag-refine-stage","topic-tag-steady-state-thermal","topic-tag-temperature","topic-tag-thermal-safety","topic-tag-velocity"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_edit_lock":["1717063624:77057"],"_edit_last":["77045"],"filter_by_optics_product":["Lumerical"],"_filter_by_optics_product":["field_64fb192ba3121"],"application_name":[""],"_application_name":["field_64a80903c8e15"],"family":[""],"_family":["field_64a809229a857"],"siebel_km_number":[""],"_siebel_km_number":["field_63ecbffce60db"],"salesforce_km_number":[""],"_salesforce_km_number":["field_63ecc018e60dc"],"km_published_date":[""],"_km_published_date":["field_64c77704499dd"],"product_version":[""],"_product_version":["field_64c776cb4fd2e"],"_bbp_forum_id":["159543"],"_bbp_topic_id":["182166"],"_bbp_author_ip":["23.216.133.136"],"_bbp_last_reply_id":["0"],"_bbp_last_active_id":["182168"],"_bbp_last_active_time":["2024-05-05 07:34:15"],"_bbp_reply_count":["0"],"_bbp_reply_count_hidden":["0"],"_bbp_voice_count":["0"],"_yoast_wpseo_content_score":["90"],"_yoast_wpseo_estimated-reading-time-minutes":["1"],"_btv_view_count":["1662"],"_bbp_likes_count":["1"]},"test":"solution"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/182166","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":13,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/182166\/revisions"}],"predecessor-version":[{"id":182182,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/182166\/revisions\/182182"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=182166"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}