{"id":182160,"date":"2024-05-05T07:13:29","date_gmt":"2024-05-05T07:13:29","guid":{"rendered":"\/knowledge\/?post_type=topic&p=182160"},"modified":"2024-05-05T09:43:32","modified_gmt":"2024-05-05T09:43:32","slug":"design-scenarios-for-thermal-safety-of-cpus","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/design-scenarios-for-thermal-safety-of-cpus\/","title":{"rendered":"Design Scenarios for thermal safety of CPUs"},"content":{"rendered":"
<\/i> Design Scenarios for thermal safety of CPUs\u00a0<\/a><\/div>\n
<\/div>\n

In this article we will explore design scenarios using Ansys Discovery to lower the temperature of the CPUs, and thus ensure thermal safety by altering the material, altering the geometry, and altering the heat sink operating environment.<\/p>\n

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Refer the attached document and Simulation files <\/a> on how to set up test cases, update design to analyze the impact of the material, geometry and heat sink operating environment on heat sink performance. We will explore these design scenarios and observe the improvements.<\/p>\n","protected":false},"template":"","class_list":["post-182160","topic","type-topic","status-publish","hentry","topic-tag-3d-design","topic-tag-altering","topic-tag-ansys-discovery","topic-tag-boundary-conditions","topic-tag-conductance","topic-tag-conductivity","topic-tag-convection","topic-tag-cpu","topic-tag-discovery-explore","topic-tag-geometry","topic-tag-heat-generation","topic-tag-heat-sink","topic-tag-height","topic-tag-material","topic-tag-pull","topic-tag-refine-stage","topic-tag-temperature","topic-tag-thermal-safety"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t