{"id":181875,"date":"2024-05-05T11:11:32","date_gmt":"2024-05-05T11:11:32","guid":{"rendered":"\/knowledge\/?post_type=topic&#038;p=181875"},"modified":"2024-05-06T05:05:20","modified_gmt":"2024-05-06T05:05:20","slug":"thermal-analysis-of-heat-sinks-with-ansys-discovery","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/thermal-analysis-of-heat-sinks-with-ansys-discovery\/","title":{"rendered":"Thermal Analysis of Heat Sinks with Ansys Discovery"},"content":{"rendered":"<div style=\"display: flex;\"><a class=\"discovery-attachments\" href=\"https:\/\/ansys13.ansys.com\/KnowledgeArticles\/Discovery\/AER_Discovery\/thermal%20analysis%20of%20HS\/Thermal%20Analysis%20of%20Heat%20Sink%20with%20Ansys%20Discovery.pdf\"> <i class=\"fa fa-file-pdf-o\" aria-hidden=\"true\"> <\/i> Thermal Analysis\u00a0<\/a><\/div>\n<div><\/div>\n<p>In this article we will learn how Ansys Discovery can be used to perform thermal analysis of a heat sink placed above two CPUs generating heat during intense computational tasks.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"size-medium wp-image-182184 aligncenter\" src=\"\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/02\/Heat-sink-1-300x264.png\" alt=\"\" width=\"300\" height=\"264\" srcset=\"https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/02\/Heat-sink-1-300x264.png 300w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/02\/Heat-sink-1-24x21.png 24w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/02\/Heat-sink-1-36x32.png 36w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/02\/Heat-sink-1-48x42.png 48w, https:\/\/innovationspace.ansys.com\/knowledge\/wp-content\/uploads\/sites\/4\/2024\/02\/Heat-sink-1.png 473w\" sizes=\"auto, (max-width: 300px) 100vw, 300px\" \/><\/p>\n<p>Please refer the attached document for steps to perform thermal simulation in Ansys Discovery. We will see how use of heat sinks guarantees thermal safety of CPUs in electronic devices.<\/p>\n<p>Download the <a href=\"https:\/\/ansys13.ansys.com\/KnowledgeArticles\/Discovery\/AER_Discovery\/thermal%20analysis%20of%20HS\/Heat_Sink_Geometry.zip&quot;\">Simulation files <\/a>from here to follow the steps in the document.<\/p>\n<p>Refer <a href=\"\/knowledge\/forums\/topic\/design-scenarios-for-thermal-safety-of-cpus\/?template=discovery\">Design Scenarios for thermal safety of CPUs<\/a> article where we will explore the impact of material, geometry, and heat sink operating environment to lower the temperature of the CPUs.<\/p>\n<p>Using <a href=\"\/knowledge\/forums\/topic\/parametric-analysis-in-heat-sink-with-two-cpus-using-ansys-discovery\/?template=discovery\">Parametric Analysis in Heat sink with two CPUs using Ansys Discovery <\/a>we will learn how changing the flow speed influences lowering the temperature of CPUs for intense computations.<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"template":"","class_list":["post-181875","topic","type-topic","status-publish","hentry","topic-tag-ansys-discovery","topic-tag-conjugate-heat-transfer","topic-tag-cpu","topic-tag-flow-speed","topic-tag-heat-flow","topic-tag-heat-sink","topic-tag-material","topic-tag-monitors","topic-tag-parametric-study","topic-tag-parametric-analysis","topic-tag-steady-state-thermal","topic-tag-temperature-contours","topic-tag-temperature-transfer","topic-tag-thermal-safety"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_edit_lock":["1717589473:77045"],"_edit_last":["77045"],"filter_by_optics_product":["Lumerical"],"_filter_by_optics_product":["field_64fb192ba3121"],"application_name":[""],"_application_name":["field_64a80903c8e15"],"family":[""],"_family":["field_64a809229a857"],"siebel_km_number":[""],"_siebel_km_number":["field_63ecbffce60db"],"salesforce_km_number":[""],"_salesforce_km_number":["field_63ecc018e60dc"],"km_published_date":[""],"_km_published_date":["field_64c77704499dd"],"product_version":[""],"_product_version":["field_64c776cb4fd2e"],"_bbp_forum_id":["159543"],"_bbp_topic_id":["181875"],"_bbp_author_ip":["23.218.248.151"],"_bbp_last_reply_id":["0"],"_bbp_last_active_id":["181877"],"_bbp_last_active_time":["2024-02-15 11:11:32"],"_bbp_reply_count":["0"],"_bbp_reply_count_hidden":["0"],"_bbp_voice_count":["0"],"_yoast_wpseo_content_score":["60"],"_yoast_wpseo_estimated-reading-time-minutes":["1"],"_btv_view_count":["6232"],"_wp_old_date":["2024-05-06"],"_bbp_likes_count":["1"]},"test":"solution"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/181875","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":7,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/181875\/revisions"}],"predecessor-version":[{"id":182188,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/181875\/revisions\/182188"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=181875"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}