This tutorial demonstrates the quantitative postprocessing capabilities of CFD-Post using a 3D model of a circuit board with a heat-generating electronic chip mounted on it. The flow over the chip is laminar and involves conjugate heat transfer. The heat transfer involves conduction in the chip and conduction and convection in the surrounding fluid. The physics of conjugate heat transfer such as this is common in many engineering applications, not just the design and cooling of electronic components. In this tutorial, you will read the case and data files and perform a number of postprocessing exercises. Please refer to the attachments to access the Solution.<\/p>\n
Attachments:
\n1. 2047901.zip<\/a>
\n2. ANSYS-CFD-Post-Tutorials_r170.pdf<\/a><\/p>\n","protected":false},"template":"","class_list":["post-178923","topic","type-topic","status-publish","hentry","topic-tag-4431","topic-tag-cfd-post","topic-tag-fluid-dynamics"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t