{"id":170495,"date":"2023-05-25T07:30:02","date_gmt":"2023-05-25T07:30:02","guid":{"rendered":"\/knowledge\/forums\/topic\/how-to-efficiently-create-geometry-for-solder-mask-and-conformal-coating-over-the-board\/"},"modified":"2023-07-31T12:34:25","modified_gmt":"2023-07-31T12:34:25","slug":"how-to-efficiently-create-geometry-for-solder-mask-and-conformal-coating-over-the-board","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/how-to-efficiently-create-geometry-for-solder-mask-and-conformal-coating-over-the-board\/","title":{"rendered":"How to efficiently create geometry for solder mask and conformal coating over the board"},"content":{"rendered":"<p>Perform the following steps: \u2022Create a rectangle: the size is the same as the size of the board; located some distance above the board (see Fig.1). Consider snapping points to the board corners and then changing the Z coordinate of the position \u2022 Select objects that represent the base for the mask, i.e. top substrate and traces (see Fig.2) \u2022Using Ctrl key, select the rectangle as well \u2022Go Modeler > Surface> Project Sheet, indicate desired thickness \u2022For resulting object, change material to Solder Mask \u2022Repeat for conformal coating creating a new rectangle and selecting solder mask as a base 3D object <\/p>\n<p>Attachments:<br \/>\n1. <a href=https:\/\/ansys13.ansys.com\/KnowledgeArticles\/Phase-2B\/2043107\/How%20to%20create%20conformal%20mask%20and%20coating%20over%20the%20board.pdf>How%20to%20create%20conformal%20mask%20and%20coating%20over%20the%20board.pdf<\/a><\/p>\n","protected":false},"template":"","class_list":["post-170495","topic","type-topic","status-publish","hentry","topic-tag-17-1","topic-tag-drawing","topic-tag-electromagnetics-electronics","topic-tag-hfss","topic-tag-modeler"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_wp_page_template":["default"],"_bbp_last_active_time":["05-25-2023  20:20:01"],"_bbp_forum_id":["153856"],"_bbp_author_ip":["209.182.204.162"],"_btv_view_count":["3676"],"siebel_km_number":["2043107"],"product_version":["17.1"],"km_published_date":["2016-09-06T00:00:00.000Z"],"family":["Electromagnetics & Electronics"],"application_name":["HFSS"]},"test":"solution"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/170495","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/170495\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=170495"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}