{"id":165270,"date":"2023-03-17T08:59:51","date_gmt":"2023-03-17T08:59:51","guid":{"rendered":"\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/"},"modified":"2023-07-31T12:30:56","modified_gmt":"2023-07-31T12:30:56","slug":"is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/","title":{"rendered":"Is it possible to include thermoelastic damping in a modal analysis?  I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic  damping in a MEMS device.  (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.)  As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input.  However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1)"},"content":{"rendered":"<p>Yes, you could use the damped modal solver accessed with MODOP,DAMP.  This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.<\/p>\n","protected":false},"template":"","class_list":["post-165270","topic","type-topic","status-publish","hentry","topic-tag-4877","topic-tag-low-frequency","topic-tag-mechanical-apdl-f-ansys","topic-tag-multiphysics-and-emag-apdl","topic-tag-structural-mechanics"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<link rel=\"canonical\" href=\"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.10\" \/>\n\t\t<meta property=\"og:locale\" content=\"en_US\" \/>\n\t\t<meta property=\"og:site_name\" content=\"Ansys Knowledge | Ansys Innovation Space\" \/>\n\t\t<meta property=\"og:type\" content=\"article\" \/>\n\t\t<meta property=\"og:title\" content=\"Is it possible to include thermoelastic damping in a modal analysis? I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic damping in a MEMS device. (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.) As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input. However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1) | Ansys Knowledge\" \/>\n\t\t<meta property=\"og:description\" content=\"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.\" \/>\n\t\t<meta property=\"og:url\" content=\"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/\" \/>\n\t\t<meta property=\"article:published_time\" content=\"2023-03-17T08:59:51+00:00\" \/>\n\t\t<meta property=\"article:modified_time\" content=\"2023-07-31T12:30:56+00:00\" \/>\n\t\t<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n\t\t<meta name=\"twitter:title\" content=\"Is it possible to include thermoelastic damping in a modal analysis? I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic damping in a MEMS device. (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.) As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input. However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1) | Ansys Knowledge\" \/>\n\t\t<meta name=\"twitter:description\" content=\"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.\" \/>\n\t\t<script type=\"application\/ld+json\" class=\"aioseo-schema\">\n\t\t\t{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/forums\\\/topic\\\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\\\/#breadcrumblist\",\"itemListElement\":[{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge#listItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\",\"nextItem\":{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/topics\\\/#listItem\",\"name\":\"Topics\"}},{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/topics\\\/#listItem\",\"position\":2,\"name\":\"Topics\",\"item\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/topics\\\/\",\"nextItem\":{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/forums\\\/topic-tag\\\/structural-mechanics\\\/#listItem\",\"name\":\"structural-mechanics\"},\"previousItem\":{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge#listItem\",\"name\":\"Home\"}},{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/forums\\\/topic-tag\\\/structural-mechanics\\\/#listItem\",\"position\":3,\"name\":\"structural-mechanics\",\"item\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/forums\\\/topic-tag\\\/structural-mechanics\\\/\",\"nextItem\":{\"@type\":\"ListItem\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/forums\\\/topic\\\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\\\/#listItem\",\"name\":\"Is it possible to include thermoelastic damping in a modal analysis?  I\\u00e2\\u20ac\\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic  damping in a MEMS device.  (In a very short period of time I\\u00e2\\u20ac\\u2122ve been able to duplicate and then extend the work of colleagues using another package.)  As in the documented example, I\\u00e2\\u20ac\\u2122ve used a harmonic excitation input.  However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. 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However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. 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I\\u00e2\\u20ac\\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic damping in a MEMS device. (In a very short period of time I\\u00e2\\u20ac\\u2122ve been able to duplicate and then extend the work of colleagues using another package.) As in the documented example, I\\u00e2\\u20ac\\u2122ve used a harmonic excitation input. However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1) | Ansys Knowledge\",\"description\":\"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\\u00e2\\u20ac\\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.\",\"inLanguage\":\"en-US\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/#website\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/forums\\\/topic\\\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\\\/#breadcrumblist\"},\"datePublished\":\"2023-03-17T08:59:51+00:00\",\"dateModified\":\"2023-07-31T12:30:56+00:00\"},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/#website\",\"url\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/\",\"name\":\"Ansys Knowledge\",\"description\":\"Ansys Innovation Space\",\"inLanguage\":\"en-US\",\"publisher\":{\"@id\":\"https:\\\/\\\/innovationspace.ansys.com\\\/knowledge\\\/#organization\"}}]}\n\t\t<\/script>\n\t\t<!-- All in One SEO -->\n\n","aioseo_head_json":{"title":"Is it possible to include thermoelastic damping in a modal analysis? I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic damping in a MEMS device. (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.) As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input. However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1) | Ansys Knowledge","description":"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.","canonical_url":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/","robots":"max-image-preview:large","keywords":"","webmasterTools":{"miscellaneous":""},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"BreadcrumbList","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/#breadcrumblist","itemListElement":[{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge#listItem","position":1,"name":"Home","item":"https:\/\/innovationspace.ansys.com\/knowledge","nextItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/topics\/#listItem","name":"Topics"}},{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/topics\/#listItem","position":2,"name":"Topics","item":"https:\/\/innovationspace.ansys.com\/knowledge\/topics\/","nextItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic-tag\/structural-mechanics\/#listItem","name":"structural-mechanics"},"previousItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge#listItem","name":"Home"}},{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic-tag\/structural-mechanics\/#listItem","position":3,"name":"structural-mechanics","item":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic-tag\/structural-mechanics\/","nextItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/#listItem","name":"Is it possible to include thermoelastic damping in a modal analysis?  I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic  damping in a MEMS device.  (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.)  As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input.  However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1)"},"previousItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/topics\/#listItem","name":"Topics"}},{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/#listItem","position":4,"name":"Is it possible to include thermoelastic damping in a modal analysis?  I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic  damping in a MEMS device.  (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.)  As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input.  However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1)","previousItem":{"@type":"ListItem","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic-tag\/structural-mechanics\/#listItem","name":"structural-mechanics"}}]},{"@type":"Organization","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/#organization","name":"Ansys Knowledge","description":"Ansys Innovation Space","url":"https:\/\/innovationspace.ansys.com\/knowledge\/"},{"@type":"WebPage","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/#webpage","url":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/","name":"Is it possible to include thermoelastic damping in a modal analysis? I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic damping in a MEMS device. (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.) As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input. However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1) | Ansys Knowledge","description":"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.","inLanguage":"en-US","isPartOf":{"@id":"https:\/\/innovationspace.ansys.com\/knowledge\/#website"},"breadcrumb":{"@id":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/#breadcrumblist"},"datePublished":"2023-03-17T08:59:51+00:00","dateModified":"2023-07-31T12:30:56+00:00"},{"@type":"WebSite","@id":"https:\/\/innovationspace.ansys.com\/knowledge\/#website","url":"https:\/\/innovationspace.ansys.com\/knowledge\/","name":"Ansys Knowledge","description":"Ansys Innovation Space","inLanguage":"en-US","publisher":{"@id":"https:\/\/innovationspace.ansys.com\/knowledge\/#organization"}}]},"og:locale":"en_US","og:site_name":"Ansys Knowledge | Ansys Innovation Space","og:type":"article","og:title":"Is it possible to include thermoelastic damping in a modal analysis? I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic damping in a MEMS device. (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.) As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input. However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1) | Ansys Knowledge","og:description":"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping.","og:url":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/","article:published_time":"2023-03-17T08:59:51+00:00","article:modified_time":"2023-07-31T12:30:56+00:00","twitter:card":"summary_large_image","twitter:title":"Is it possible to include thermoelastic damping in a modal analysis? I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic damping in a MEMS device. (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.) As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input. However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1) | Ansys Knowledge","twitter:description":"Yes, you could use the damped modal solver accessed with MODOP,DAMP. This solver is quite slow, so we typically don\u00e2\u20ac\u2122t recommend it, however, the more robust and much faster damped modal solver accessed with MODOP,QRDAMP does not correctly handle the unsymmetric K matrix produced by thermo-elastic damping."},"aioseo_meta_data":{"post_id":"165270","title":null,"description":null,"keywords":null,"keyphrases":null,"primary_term":null,"canonical_url":null,"og_title":null,"og_description":null,"og_object_type":"default","og_image_type":"default","og_image_url":null,"og_image_width":null,"og_image_height":null,"og_image_custom_url":null,"og_image_custom_fields":null,"og_video":null,"og_custom_url":null,"og_article_section":null,"og_article_tags":null,"twitter_use_og":false,"twitter_card":"default","twitter_image_type":"default","twitter_image_url":null,"twitter_image_custom_url":null,"twitter_image_custom_fields":null,"twitter_title":null,"twitter_description":null,"schema":{"blockGraphs":[],"customGraphs":[],"default":{"data":{"Article":[],"Course":[],"Dataset":[],"FAQPage":[],"Movie":[],"Person":[],"Product":[],"ProductReview":[],"Car":[],"Recipe":[],"Service":[],"SoftwareApplication":[],"WebPage":[]},"graphName":"","isEnabled":true},"graphs":[]},"schema_type":"default","schema_type_options":null,"pillar_content":false,"robots_default":true,"robots_noindex":false,"robots_noarchive":false,"robots_nosnippet":false,"robots_nofollow":false,"robots_noimageindex":false,"robots_noodp":false,"robots_notranslate":false,"robots_max_snippet":null,"robots_max_videopreview":null,"robots_max_imagepreview":"large","priority":null,"frequency":null,"local_seo":null,"limit_modified_date":false,"created":"2025-10-17 22:02:49","updated":"2026-07-29 16:23:06","ai":null,"breadcrumb_settings":null,"seo_analyzer_scan_date":null},"aioseo_breadcrumb":"<div class=\"aioseo-breadcrumbs\"><span class=\"aioseo-breadcrumb\">\n\t\t\t<a href=\"https:\/\/innovationspace.ansys.com\/knowledge\" title=\"Home\">Home<\/a>\n\t\t<\/span><span class=\"aioseo-breadcrumb-separator\">&raquo;<\/span><span class=\"aioseo-breadcrumb\">\n\t\t\t<a href=\"https:\/\/innovationspace.ansys.com\/knowledge\/topics\/\" title=\"Topics\">Topics<\/a>\n\t\t<\/span><span class=\"aioseo-breadcrumb-separator\">&raquo;<\/span><span class=\"aioseo-breadcrumb\">\n\t\t\t<a href=\"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic-tag\/structural-mechanics\/\" title=\"structural-mechanics\">structural-mechanics<\/a>\n\t\t<\/span><span class=\"aioseo-breadcrumb-separator\">&raquo;<\/span><span class=\"aioseo-breadcrumb\">\n\t\t\tIs it possible to include thermoelastic damping in a modal analysis?  I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic  damping in a MEMS device.  (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.)  As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input.  However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1)\n\t\t<\/span><\/div>","aioseo_breadcrumb_json":[{"label":"Home","link":"https:\/\/innovationspace.ansys.com\/knowledge"},{"label":"Topics","link":"https:\/\/innovationspace.ansys.com\/knowledge\/topics\/"},{"label":"structural-mechanics","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic-tag\/structural-mechanics\/"},{"label":"Is it possible to include thermoelastic damping in a modal analysis?  I\u00e2\u20ac\u2122ve been able to successfully use plane223 and solid226 elements to model thermoelastic  damping in a MEMS device.  (In a very short period of time I\u00e2\u20ac\u2122ve been able to duplicate and then extend the work of colleagues using another package.)  As in the documented example, I\u00e2\u20ac\u2122ve used a harmonic excitation input.  However, I would also like to repeat the analysis by using the eigenvector solution as the strain energy input. (Similar to ref #1)","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/is-it-possible-to-include-thermoelastic-damping-in-a-modal-analysis-iaeve-been-able-to-successfully-use-plane223-and-solid226-elements-to-model-thermoelastic-damping-in-a-mems-device-in\/"}],"acf":[],"custom_fields":[{"0":{"_wp_page_template":["default"],"_bbp_last_active_time":["3\/15\/2023 20:20"],"_bbp_forum_id":["27789"],"_bbp_author_ip":["23.56.168.180"],"_btv_view_count":["821"],"siebel_km_number":["568268"],"product_version":["10"],"km_published_date":["2006-12-28T00:00:00.000Z"],"family":["Structural Mechanics"],"application_name":["Mechanical APDL (f. ANSYS)"]},"test":"articlesansys-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/165270","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/165270\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=165270"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}