{"id":163196,"date":"2023-01-31T09:25:44","date_gmt":"2023-01-31T09:25:44","guid":{"rendered":"\/knowledge\/forums\/topic\/hfss-3d-layout-%e3%81%a7%e5%b0%8e%e4%bd%93%e5%b1%a4%ef%bc%88%e9%9b%bb%e6%b5%81%e5%8d%b0%e5%8a%a0-%e7%99%ba%e7%86%b1%ef%bc%89%e3%80%81%e8%aa%98%e9%9b%bb%e4%bd%93%e5%b1%a4%e3%81%ae2%e5%b1%a4%e3%81%ae\/"},"modified":"2023-07-31T12:38:07","modified_gmt":"2023-07-31T12:38:07","slug":"hfss-3d-layout-%e3%81%a7%e5%b0%8e%e4%bd%93%e5%b1%a4%ef%bc%88%e9%9b%bb%e6%b5%81%e5%8d%b0%e5%8a%a0-%e7%99%ba%e7%86%b1%ef%bc%89%e3%80%81%e8%aa%98%e9%9b%bb%e4%bd%93%e5%b1%a4%e3%81%ae2%e5%b1%a4%e3%81%ae","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/hfss-3d-layout-%e3%81%a7%e5%b0%8e%e4%bd%93%e5%b1%a4%ef%bc%88%e9%9b%bb%e6%b5%81%e5%8d%b0%e5%8a%a0-%e7%99%ba%e7%86%b1%ef%bc%89%e3%80%81%e8%aa%98%e9%9b%bb%e4%bd%93%e5%b1%a4%e3%81%ae2%e5%b1%a4%e3%81%ae\/","title":{"rendered":"HFSS 3D layout \u3067\u5c0e\u4f53\u5c64\uff08\u96fb\u6d41\u5370\u52a0\/\u767a\u71b1\uff09\u3001\u8a98\u96fb\u4f53\u5c64\u306e2\u5c64\u306e\u307f\u306e\u89e3\u6790\u30e2\u30c7\u30eb\u3067 AEDT Icepak \u3067\u71b1\u6d41\u4f53\u89e3\u6790\u3067\u304d\u307e\u3059\u304b\uff1f"},"content":{"rendered":"<p>HFSS 3D Layout \u3067\u4f5c\u6210\u3057\u305f\u57fa\u677f\u60c5\u5831\u306f AEDT Icepak \u306e PCB \u30b3\u30f3\u30dd\u30fc\u30cd\u30f3\u30c8\u306b\u3066\u914d\u7dda\u5c64\u3001\u767a\u71b1\u640d\u5931\u306e\u60c5\u5831\u304c\u53d6\u308a\u8fbc\u3081\u307e\u3059.  PCB \u30b3\u30f3\u30dd\u30fc\u30cd\u30f3\u30c8\u306f\u591a\u5c64\u57fa\u677f\u3092\u60f3\u5b9a\u3057\u3066\u4f5c\u6210\u3055\u308c\u3066\u3044\u308b\u30e2\u30c7\u30eb\u306b\u306a\u308a\u307e\u3059\u306e\u3067\u3001 3D Layout \u5074\u3067\u5c0e\u4f53\u5c64\u3001\u8a98\u96fb\u4f53\u5c64\u306e\uff12\u5c64\u306e\u307f\u3067\u30e2\u30c7\u30eb\u5316\u3055\u308c\u305f\u30e2\u30c7\u30eb\u306f \u73fe\u5728\u306e PCB \u30b3\u30f3\u30dd\u30fc\u30cd\u30f3\u30c8\u3067\u306f\u767a\u71b1\u640d\u5931\u3001\u6750\u6599\u7269\u6027\u304c\u9069\u5207\u306b\u30de\u30c3\u30d4\u30f3\u30b0\u3055\u308c\u307e\u305b\u3093.  \u5bfe\u51e6\u65b9\u6cd5\u3068\u3057\u307e\u3057\u3066\u30013D Layout \u5074\u3067\u5c0e\u4f53\u5c64\uff08\u767a\u71b1\uff09\u3001\u8a98\u96fb\u4f53\u5c64\u3001\uff08\u30b0\u30e9\u30a6\u30f3\u30c9\uff09\u5c0e\u4f53\u5c64\u306e \uff13\u5c64\u4f5c\u6210\u3059\u308b\u3053\u3068\u3067\u9069\u5207\u306a\u4f4d\u7f6e\u306b\u767a\u71b1\u640d\u5931\u3001\u6750\u6599\u7269\u6027\u304c\u30de\u30c3\u30d4\u30f3\u30b0\u3055\u308c\u307e\u3059.<\/p>\n","protected":false},"template":"","class_list":["post-163196","topic","type-topic","status-publish","hentry","topic-tag-2021-r2","topic-tag-3d-components","topic-tag-icepak-aedt","topic-tag-model-building"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_wp_page_template":["default"],"_bbp_last_active_time":["1-31-2023  20:20:28"],"_bbp_forum_id":["162366"],"_bbp_author_ip":["209.182.204.162"],"_btv_view_count":["1020"],"siebel_km_number":["2066990"],"product_version":["2021 R2"],"km_published_date":["12\/14\/2021 23:46"],"family":["Electromagnetics & Electronics"],"application_name":["Icepak (AEDT)"]},"test":"articlesansys-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/163196","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/163196\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=163196"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}