{"id":160149,"date":"2022-09-26T10:00:43","date_gmt":"2022-09-26T10:00:43","guid":{"rendered":"\/knowledge\/forums\/topic\/discovery-live-application-examples-thermal\/"},"modified":"2023-08-16T06:33:36","modified_gmt":"2023-08-16T06:33:36","slug":"discovery-live-application-examples-thermal","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/discovery-live-application-examples-thermal\/","title":{"rendered":"Discovery Live: Application Examples Thermal"},"content":{"rendered":"

Thermal management was once a second thought but is still not pervasive through the entire design process.\u00a0 ANSYS Discovery Live enables designers of any level\u00a0to explore endless ideas and configurations in a fraction of time to easily exceed design goals.\u00a0<\/strong><\/p>\n

Download and open these pre-solved\u00a0examples to gain an understanding of what ANSYS\u00a0can help you Discover Live.<\/strong><\/p>\n

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1)\u00a0Thermal Simulation of a Cold Plate\u00a0<\/strong><\/p>\n

Application example of a cold plate utilizing\u00a0a convection region with a modified film coefficient to replicate the water flow through the cooling pipes.\u00a0\u00a0This project requires release 19.2\u00a0or newer.<\/p>\n

Download the file here<\/a><\/p>\n

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2)\u00a0Thermal simulation of a PCB w\/heatsink<\/strong><\/p>\n

Application example of the solid temperature in a board with a heat source and a heat sink is simulated.\u00a0 The impact of changing the shape and size of the heat sink, within the constraints of the enclosure, on the max temperature on the surface of the board can be studied.\u00a0This project requires release 19.2\u00a0or newer.<\/p>\n

Download the file here<\/a><\/p>\n

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3)\u00a0Parametric Design Study of a Heat Sink<\/strong><\/p>\n

Application example of a heat sink utilizing Discovery Live\u2019s parametric study tool to explore multiple design configurations. This project requires release 19.2\u00a0or newer.<\/p>\n

Download the file here<\/a><\/p>\n

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4)\u00a0Thermal Simulation of a CPU Cooler<\/strong><\/p>\n

Application example of a heat sink with\u00a0cooling pipes and patterns of fins for CPU cooling\u00a0utilizing convection and multiple multerials.\u00a0\u00a0This project requires release 19.2\u00a0or newer.<\/p>\n

Download the file here<\/a>
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5)\u00a0Thermal Simulation of a Electronics Cooling Assembly<\/strong><\/p>\n

Application example of an electronics cooling assembly with a heat sink and heatpipes to cool multiple electrical components.<\/p>\n

Download the file here<\/a><\/p>\n

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