{"id":160110,"date":"2022-09-26T10:00:32","date_gmt":"2022-09-26T10:00:32","guid":{"rendered":"\/knowledge\/forums\/topic\/discovery-aim-tutorial-3d-convection-through-an-electronics-box\/"},"modified":"2023-08-16T06:33:32","modified_gmt":"2023-08-16T06:33:32","slug":"discovery-aim-tutorial-3d-convection-through-an-electronics-box","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/discovery-aim-tutorial-3d-convection-through-an-electronics-box\/","title":{"rendered":"Discovery AIM tutorial &#8211; 3D Convection through an Electronics Box"},"content":{"rendered":"<nav>\n<hr \/>\n<p><strong>This example is taken from\u00a0<u><a href=\"https:\/\/confluence.cornell.edu\/display\/SIMULATION\/ANSYS+AIM+-+3D+Electronics+Box\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">Cornell University&#8217;s ANSYS AIM Learning Modules<\/a><\/u><\/strong><\/p>\n<\/nav>\n<nav class=\"toc -selected\">Contents<\/p>\n<ol class=\"toc__section -lev0\">\n<li class=\"toc__item -lev0\">Learning Goals<\/li>\n<li class=\"toc__item -lev0\">Problem Specification<\/li>\n<li class=\"toc__item -lev0\">Geometry<\/li>\n<li class=\"toc__item -lev0\">Mesh<\/li>\n<li class=\"toc__item -lev0\">Physics Setup<\/li>\n<li class=\"toc__item -lev0\">Results Evaluation<\/li>\n<\/ol>\n<\/nav>\n<h4 content_id=\"learning-goals\" class=\"toc__permalink\" content_id=\"learning-goals\" class=\"toc__permalink\"  id=\"LEARNING-GOALS\"><strong>Learning Goals<\/strong><\/h4>\n<p>In this tutorial,\u00a0you will learn to determine:<\/p>\n<ul>\n<li>Fluid volume extraction<\/li>\n<li>Flow field within the box and maximum temperature on the components.<\/li>\n<\/ul>\n<hr \/>\n<h4 content_id=\"problem-specification\" class=\"toc__permalink\" content_id=\"problem-specification\" class=\"toc__permalink\"  id=\"PROBLEM-SPECIFICATION\"><strong>Problem Specification<\/strong><\/h4>\n<p>Currently, a design for an electronics box calls for 10 electronic boards and a CPU to be enclosed. All these electronic components will generate heat of 40,682 watts per meter cube. The current design uses two fans to blow air through the box to cool the electronics. The fans blow air at a rate of 35 cubic feet per minute i.e. 57.609 inches\/second. The box is expected to operate in an environment where the temperature reaches a maximum of 114 degrees Fahrenheit. The main constraint on the design is that the electronic components need to be maintained below 200 degrees Fahrenheit, otherwise the components could be damaged.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-full wp-image-156947\" src=\"\/knowledge\/wp-content\/uploads\/sites\/4\/2022\/08\/HM-1.png\" alt=\" width=\"914\" height=\"558\" \/><\/p>\n<p>The box itself is ABS plastic, the components will be modeled as copper.\u00a0This tutorial will show you how to use Discovery AIM to model this problem.<\/p>\n<hr \/>\n<h4 content_id=\"geometry\" class=\"toc__permalink\" content_id=\"geometry\" class=\"toc__permalink\"  id=\"GEOMETRY\">Geometry<\/h4>\n<p><a style=\"color:#1E6DDC;font-weight:bold;text-decoration:none;\"  href=\"https:\/\/ansys13.ansys.com\/KnowledgeArticles\/Discovery\/3D-Convection-through-an-Electronics-Box.zip\" download>Download the file here<\/a><\/p>\n<p>The following video shows how\u00a0to:<\/p>\n<ul>\n<li>import the geometry.<\/li>\n<li>open geometry editor to fill small holes and create flow volume.<\/li>\n<\/ul>\n<p><iframe loading=\"lazy\" class=\"vidyard_iframe\" src=\"\/\/play.vidyard.com\/fEWnQXP1hnrKe88tBQ9aWT.html?\" width=\"700\" height=\"400\" frameborder=\"0\" scrolling=\"no\" allowfullscreen=\"allowfullscreen\"><\/iframe><\/p>\n<hr \/>\n<h4 content_id=\"mesh\" class=\"toc__permalink\" content_id=\"mesh\" class=\"toc__permalink\"  id=\"MESH\"><strong>Mesh<\/strong><\/h4>\n<p>In this tutorial, we will be using\u00a0<strong>Automatic\u00a0Physics-Aware Meshing<\/strong>.\u00a0Automatic physics-aware\u00a0meshing\u00a0helps automate and simplify your problem setup. With automatic physics-aware meshing, the computational mesh is generated automatically based on the solution fidelity setting and the physics\u00a0inputs.<\/p>\n<hr \/>\n<h4 content_id=\"physics-setup\" class=\"toc__permalink\" content_id=\"physics-setup\" class=\"toc__permalink\"  id=\"PHYSICS-SETUP\"><strong>Physics Setup<\/strong><\/h4>\n<p>The video below demonstrates how to specify the flow and thermal boundary conditions for the electronics box simulation.<\/p>\n<p><iframe loading=\"lazy\" class=\"vidyard_iframe\" src=\"\/\/play.vidyard.com\/aVbY8d9HZ279353AVvHeTT.html?\" width=\"700\" height=\"400\" frameborder=\"0\" scrolling=\"no\" allowfullscreen=\"allowfullscreen\"><\/iframe><\/p>\n<hr \/>\n<h4 content_id=\"results-evaulation\" class=\"toc__permalink\" content_id=\"results-evaulation\" class=\"toc__permalink\"  id=\"RESULTS-EVAULATION\"><strong>Results Evaulation<\/strong><\/h4>\n<p>The video below shows how to:<\/p>\n<ul>\n<li>Change the arrow sizing and number of symbols to 5000 under the velocity result.<\/li>\n<li>Add a temperature contour and animate the results.<\/li>\n<\/ul>\n<p><iframe loading=\"lazy\" class=\"vidyard_iframe\" src=\"\/\/play.vidyard.com\/oHgtTtqLMFXDs1LWicx5Em.html?\" width=\"700\" height=\"400\" frameborder=\"0\" scrolling=\"no\" allowfullscreen=\"allowfullscreen\"><\/iframe><\/p>\n<hr \/>\n","protected":false},"template":"","class_list":["post-160110","topic","type-topic","status-publish","hentry","topic-tag-aim-tutorial","topic-tag-discovery-aim","topic-tag-fluids"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_wp_page_template":["default"],"_bbp_last_active_time":["09-13-2022  20:20:16"],"_bbp_forum_id":["159552"],"_btv_view_count":["555"],"family":[""],"application_name":[""],"product_version":[""],"_bbp_likes_count":["1"]},"test":"watchlearnansys-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/160110","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/160110\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=160110"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}