{"id":160100,"date":"2022-09-26T10:00:26","date_gmt":"2022-09-26T10:00:26","guid":{"rendered":"\/knowledge\/forums\/topic\/discovery-aim-structural-thermal-electromagnetics-simulation-of-led-chip-joule-heating\/"},"modified":"2023-08-16T06:33:31","modified_gmt":"2023-08-16T06:33:31","slug":"discovery-aim-structural-thermal-electromagnetics-simulation-of-led-chip-joule-heating","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/discovery-aim-structural-thermal-electromagnetics-simulation-of-led-chip-joule-heating\/","title":{"rendered":"Discovery AIM &#8211; Structural-Thermal-Electromagnetics Simulation of LED Chip Joule Heating"},"content":{"rendered":"<p><img decoding=\"async\" src=\"\/knowledge\/wp-content\/uploads\/sites\/4\/2022\/08\/547-25.png\"><\/p>\n<p> <a style=\"color:#1E6DDC;font-weight:bold;text-decoration:none;\"  href=\"https:\/\/ansys13.ansys.com\/KnowledgeArticles\/Discovery\/Structural-Thermal-Electromagnetics-Simulation-of-LED-Chip-Joule-Heating.zip\" download>Download the file here<\/a><\/p>\n<p>Application example of Joule heating of an LED chip. The Joule heating and temperature distribution are calculated based on the electric potential across the LED and the electrical resistance of the chip. The thermal stress in the chip is calculated based on the temperature distribution. This project requires release 19.0 or newer.<\/p>\n","protected":false},"template":"","class_list":["post-160100","topic","type-topic","status-publish","hentry","topic-tag-aim-app-example","topic-tag-application-examples","topic-tag-discovery-aim","topic-tag-electromagnetics","topic-tag-electronics","topic-tag-structures","topic-tag-thermal"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_wp_page_template":["default"],"_bbp_last_active_time":["09-13-2022  20:20:06"],"_bbp_forum_id":["159552"],"_btv_view_count":["791"],"family":[""],"application_name":[""],"product_version":[""],"_bbp_likes_count":["1"]},"test":"solution"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/160100","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/160100\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=160100"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}