{"id":159941,"date":"2022-09-26T09:59:43","date_gmt":"2022-09-26T09:59:43","guid":{"rendered":"\/knowledge\/forums\/topic\/discovery-live-thermal-simulation-of-a-pcb-w-heatsink\/"},"modified":"2023-08-16T06:33:15","modified_gmt":"2023-08-16T06:33:15","slug":"discovery-live-thermal-simulation-of-a-pcb-w-heatsink","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/discovery-live-thermal-simulation-of-a-pcb-w-heatsink\/","title":{"rendered":"Discovery Live – Thermal simulation of a PCB w\/heatsink"},"content":{"rendered":"

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Download the file here<\/a>
\nApplication example of the solid temperature in a board with a heat source and a heat sink is simulated.\u00a0 The impact of changing the shape and size of the heat sink, within the constraints of the enclosure, on the max temperature on the surface of the board can be studied.\u00a0This project requires release 19.2\u00a0or newer.<\/p>\n<\/div>\n","protected":false},"template":"","class_list":["post-159941","topic","type-topic","status-publish","hentry","topic-tag-discovery-live","topic-tag-live-app-example","topic-tag-thermal"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t