{"id":159085,"date":"2022-07-04T07:00:11","date_gmt":"2022-07-04T07:00:11","guid":{"rendered":"\/knowledge\/forums\/topic\/ansys-siwave-electrothermal-analyses-of-a-pcb-part-iii\/"},"modified":"2022-07-04T07:23:47","modified_gmt":"2022-07-04T07:23:47","slug":"ansys-siwave-electrothermal-analyses-of-a-pcb-part-iii","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/knowledge\/forums\/topic\/ansys-siwave-electrothermal-analyses-of-a-pcb-part-iii\/","title":{"rendered":"ANSYS SIwave: Electrothermal Analyses of a PCB &#8211; Part III"},"content":{"rendered":"<p>This video demonstrates how to perform post processing in SIwave and Icepak after specifying Natural Convection as the thermal simulation type. ANSYS SIwave is a specialized design platform for power integrity, signal integrity and EMI analysis of electronic packages and PCBs.<br \/>\n<iframe loading=\"lazy\" title=\"ANSYS SIwave: Electrothermal Analyses of a PCB - Part III\" width=\"640\" height=\"360\" src=\"https:\/\/www.youtube.com\/embed\/pWObbHmDDvs?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe><\/p>\n","protected":false},"template":"","class_list":["post-159085","topic","type-topic","status-publish","hentry","topic-tag-ansys-siwave","topic-tag-dcir","topic-tag-ddr3","topic-tag-icepak","topic-tag-microprocessor","topic-tag-pcb","topic-tag-power-loss","topic-tag-power-integrity","topic-tag-schematic","topic-tag-signal-integrity-analysis","topic-tag-siwave","topic-tag-voltage-regulator-module","topic-tag-vrm"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_wp_page_template":["default"],"_bbp_last_active_time":["3\/6\/2022 20:20"],"_bbp_forum_id":["153856"],"_btv_view_count":["1732"],"_edit_lock":["1656919542:76714"],"_edit_last":["76714"],"_bbp_topic_id":["159085"],"_oembed_5180708ac23570fcd5d6582a6edc276e":["<iframe title=\"ANSYS SIwave: Electrothermal Analyses of a PCB - Part III\" width=\"640\" height=\"360\" src=\"https:\/\/www.youtube.com\/embed\/pWObbHmDDvs?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture\" allowfullscreen><\/iframe>"],"_oembed_time_5180708ac23570fcd5d6582a6edc276e":["1656919518"],"_oembed_ed6cf6fa8382896e2d7ac98bb4465d68":["<iframe title=\"ANSYS SIwave: Electrothermal Analyses of a PCB - Part III\" width=\"640\" height=\"360\" src=\"https:\/\/www.youtube.com\/embed\/pWObbHmDDvs?feature=oembed\" frameborder=\"0\" allow=\"accelerometer; autoplay; clipboard-write; encrypted-media; gyroscope; picture-in-picture; web-share\" referrerpolicy=\"strict-origin-when-cross-origin\" allowfullscreen><\/iframe>"],"_oembed_time_ed6cf6fa8382896e2d7ac98bb4465d68":["1712386369"]},"test":"watchlearnansys-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/159085","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/topics\/159085\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/knowledge\/wp-json\/wp\/v2\/media?parent=159085"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}