{"id":51961,"date":"2021-02-06T08:12:29","date_gmt":"2021-02-06T08:12:29","guid":{"rendered":"\/forum\/forums\/topic\/thermal-cycling\/"},"modified":"2021-02-06T08:12:29","modified_gmt":"2021-02-06T08:12:29","slug":"thermal-cycling","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/thermal-cycling\/","title":{"rendered":"thermal cycling"},"content":{"rendered":"<p>\u00a0I want to do a thermal cycling on an IGBT module  and analyze it for solder layer fatigue . I have managed to design and give material properties. However, when trying to run the simulation, I am getting an error saying, your product license has numerical problem size limits, you have exceeded these problem size limits and the solver cannot proceed.nCould someone guide me on how to overcome this?n<\/p>\n","protected":false},"template":"","class_list":["post-51961","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"I want to do a thermal cycling on an IGBT module and analyze it for solder layer fatigue . I have managed to design and give material properties. 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