{"id":460660,"date":"2026-07-02T15:28:30","date_gmt":"2026-07-02T15:28:30","guid":{"rendered":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/how-to-define-the-contact-thermal-resistance\/"},"modified":"2026-07-02T15:59:45","modified_gmt":"2026-07-02T15:59:45","slug":"how-to-define-the-contact-thermal-resistance","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/how-to-define-the-contact-thermal-resistance\/","title":{"rendered":"How to define the contact thermal resistance"},"content":{"rendered":"<p>&lt;p&gt;&lt;p&gt;I would like to ask how to define the contact thermal resistance between dual thermal resistance components and other entities, such as the ultra-thin thermal conductive material between the chip and the heat dissipation housing\u3002&lt;\/p&gt;&lt;\/p&gt;<\/p>\n","protected":false},"template":"","class_list":["post-460660","topic","type-topic","status-publish","hentry","topic-tag-AEDTICEPAK-1","topic-tag-ansys-icepak"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_forum_id":["27793"],"_bbp_topic_id":["460660"],"_bbp_subscription":["705357","681278"],"_bbp_author_ip":["5.34.216.210"],"_bbp_last_reply_id":["461000"],"_bbp_last_active_id":["461000"],"_bbp_last_active_time":["2026-07-07 15:24:44"],"_bbp_reply_count":["2"],"_bbp_reply_count_hidden":["0"],"_bbp_voice_count":["2"],"_bbp_engagement":["705357","681278"],"_btv_view_count":["54"],"_bbp_topic_status":["unanswered"],"_bbp_notification_enabled":["705357"],"_edit_last":["705357"],"_bbp_revision_log":["a:1:{i:460666;a:2:{s:6:\"author\";i:705357;s:6:\"reason\";s:0:\"\";}}"],"_edit_lock":["1783008019:705357"]},"test":"jiangshuo22mails-jlu-edu-cn"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/460660","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":1,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/460660\/revisions"}],"predecessor-version":[{"id":460666,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/460660\/revisions\/460666"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=460660"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}