{"id":457087,"date":"2026-04-25T09:15:58","date_gmt":"2026-04-25T09:15:58","guid":{"rendered":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/case-studies-on-thermal-stress-simulation-for-multi-die-25d-packaging-2\/"},"modified":"2026-04-25T09:15:58","modified_gmt":"2026-04-25T09:15:58","slug":"case-studies-on-thermal-stress-simulation-for-multi-die-25d-packaging-2","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/case-studies-on-thermal-stress-simulation-for-multi-die-25d-packaging-2\/","title":{"rendered":"Case studies on thermal-stress simulation for multi-die 2.5D packaging"},"content":{"rendered":"<p>&lt;p&gt;<strong>Our project is currently exploring the impact of packaging simulation on multi-die (including sensors and ASIC chips). We would like to see how various parameters of the chips and sensors change after thermal-stress simulation. Are there any relevant case studies on 2.5D multi-die packaging simulation available?<\/strong>&lt;\/p&gt;<\/p>\n","protected":false},"template":"","class_list":["post-457087","topic","type-topic","status-publish","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_forum_id":["27793"],"_bbp_topic_id":["457087"],"_bbp_subscription":["680201","28551"],"_bbp_author_ip":["2001:250:3002:8240::b56"],"_bbp_last_reply_id":["457241"],"_bbp_last_active_id":["457241"],"_bbp_last_active_time":["2026-04-28 06:37:31"],"_bbp_reply_count":["2"],"_bbp_reply_count_hidden":["0"],"_bbp_voice_count":["2"],"_bbp_engagement":["680201","28551"],"_btv_view_count":["34"],"_bbp_topic_status":["unanswered"]},"test":"pangzw3mail2-sysu-edu-cn"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/457087","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/457087\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=457087"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}