{"id":422367,"date":"2025-02-19T13:54:33","date_gmt":"2025-02-19T13:54:33","guid":{"rendered":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/gdsii-import-to-hfss-not-working-properly\/"},"modified":"2025-02-21T16:47:32","modified_gmt":"2025-02-21T16:47:32","slug":"gdsii-import-to-hfss-not-working-properly","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/gdsii-import-to-hfss-not-working-properly\/","title":{"rendered":"GDSII import to HFSS not working properly"},"content":{"rendered":"<p>&lt;p&gt;&lt;p&gt;&lt;p&gt;&lt;p&gt;Hello, I have a GDS file of a chip, containing not the full chip but only some metal and via layers, since that&#8217;s what I&#8217;m interested to simulate. When I import it to HFSS (providing as well the technology and layer map files) I get the warning:&nbsp;&lt;\/p&gt;&lt;p&gt;<strong>&nbsp;[warning] GDSII Translation: 4 of 5 layers in the .gds file will not be imported. <\/strong>&lt;br&gt;&lt;br&gt;&lt;\/p&gt;&lt;p&gt;Then in the 3D view I only see one of the layers, the rest are missing. Why is this hapenning? I hope you can help me. Thanks.&lt;\/p&gt;&lt;\/p&gt;&lt;p&gt; &lt;\/p&gt;&lt;p&gt;PD: I&#8217;m using Electronics Desktop 2024 R2.&lt;\/p&gt;&lt;\/p&gt;&lt;p&gt; &lt;\/p&gt;&lt;p&gt;Edit: to provide more info, I tried with the GDS of the full chip, around 1GB. Then in the importer window I add the technology &amp; layer map files and I only select to import the last 2 metal and via layers, then HFSS gets stuck while taking almost 100GB of RAM, and it continues stuck for days.&lt;\/p&gt;&lt;\/p&gt;<\/p>\n","protected":false},"template":"","class_list":["post-422367","topic","type-topic","status-publish","hentry","topic-tag-gds-1","topic-tag-gdsii-1","topic-tag-hfss","topic-tag-import"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_forum_id":["27793"],"_bbp_topic_id":["422367"],"_bbp_subscription":["66166","258650"],"_bbp_author_ip":["128.141.223.93"],"_bbp_last_reply_id":["425597"],"_bbp_last_active_id":["425597"],"_bbp_last_active_time":["2025-03-13 16:59:20"],"_bbp_reply_count":["1"],"_bbp_reply_count_hidden":["0"],"_bbp_voice_count":["2"],"_bbp_engagement":["66166","258650"],"_btv_view_count":["585"],"_bbp_topic_status":["unanswered"],"_edit_last":["66166"],"_bbp_revision_log":["a:2:{i:422803;a:2:{s:6:\"author\";i:66166;s:6:\"reason\";s:0:\"\";}i:422804;a:2:{s:6:\"author\";i:66166;s:6:\"reason\";s:0:\"\";}}"]},"test":"francisco-piernas-diazcern-ch"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/422367","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":2,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/422367\/revisions"}],"predecessor-version":[{"id":422804,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/422367\/revisions\/422804"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=422367"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}