{"id":392066,"date":"2024-10-30T16:40:14","date_gmt":"2024-10-30T16:40:14","guid":{"rendered":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/is-it-normal-that-dielectric-fill-is-invisible-in-layout-component-under-hfss\/"},"modified":"2024-10-30T16:49:39","modified_gmt":"2024-10-30T16:49:39","slug":"is-it-normal-that-dielectric-fill-is-invisible-in-layout-component-under-hfss","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/is-it-normal-that-dielectric-fill-is-invisible-in-layout-component-under-hfss\/","title":{"rendered":"Is it normal that dielectric fill is invisible in layout component under HFSS ?"},"content":{"rendered":"<p>&lt;p&gt;&lt;p&gt;The layer &#8220;Pistes&#8221; is normally filled by PET :&lt;\/p&gt;&lt;p&gt;<img decoding=\"async\" src=\"https:\/\/innovationspace.ansys.com\/forum\/wp-content\/uploads\/sites\/2\/2024\/10\/30-10-2024-1730306231-mceclip1.png\" \/>&lt;\/p&gt;&lt;p&gt;<img decoding=\"async\" src=\"https:\/\/innovationspace.ansys.com\/forum\/wp-content\/uploads\/sites\/2\/2024\/10\/30-10-2024-1730306265-mceclip2.png\" \/>&lt;\/p&gt;&lt;p&gt;<img decoding=\"async\" src=\"https:\/\/innovationspace.ansys.com\/forum\/wp-content\/uploads\/sites\/2\/2024\/10\/30-10-2024-1730306300-mceclip3.png\" \/>&lt;\/p&gt;&lt;p&gt;&lt;\/p&gt;&lt;p&gt; &lt;\/p&gt;&lt;p&gt;But when importing the 3d-layout component under HFSS, I do not see the filled dielectric. But I see other dielectric &#8230;. :&lt;\/p&gt;&lt;p&gt;&lt;\/p&gt;&lt;p&gt;<img decoding=\"async\" src=\"https:\/\/innovationspace.ansys.com\/forum\/wp-content\/uploads\/sites\/2\/2024\/10\/30-10-2024-1730306977-mceclip0.png\" \/>&lt;\/p&gt;&lt;p&gt;&lt;\/p&gt;&lt;p&gt;Is it a bug ? How to be sure the dielectric is well filled ??&lt;\/p&gt;&lt;p&gt;Thanks !&lt;\/p&gt;&lt;p&gt; &lt;\/p&gt;&lt;\/p&gt;<\/p>\n","protected":false},"template":"","class_list":["post-392066","topic","type-topic","status-publish","hentry","topic-tag-3D-layout-1"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_author_ip":["90.22.168.237"],"_btv_view_count":["490"],"_bbp_topic_status":["unanswered"],"_edit_last":["287497"],"_bbp_revision_log":["a:1:{i:392071;a:2:{s:6:\"author\";i:287497;s:6:\"reason\";s:0:\"\";}}"],"_bbp_subscription":["258650"],"_bbp_topic_id":["392066"],"_bbp_forum_id":["27793"],"_bbp_engagement":["258650","287497"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["392458"],"_bbp_last_active_id":["392458"],"_bbp_last_active_time":["2024-11-01 23:35:27"]},"test":"alexandre-antoi-bourrieauac-creteil-fr"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/392066","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":1,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/392066\/revisions"}],"predecessor-version":[{"id":392071,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/392066\/revisions\/392071"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=392066"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}