{"id":390934,"date":"2024-10-22T22:26:44","date_gmt":"2024-10-22T22:26:44","guid":{"rendered":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/about-siwave-edb-stackup\/"},"modified":"2024-10-23T11:08:51","modified_gmt":"2024-10-23T11:08:51","slug":"about-siwave-edb-stackup","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/about-siwave-edb-stackup\/","title":{"rendered":"About siwave edb stackup."},"content":{"rendered":"<p>&lt;p&gt;&lt;p&gt;I have two questions:&lt;br&gt;First&nbsp; if a file format is extracted as edb with a stackup set in altium, will the dielectric and layer thicknesses be added in the same way in the stackup in siwave?&lt;\/p&gt;&lt;p&gt;Didn&#8217;t we already specify the prepreg and core materials in the layers below?&lt;\/p&gt;&lt;p&gt;My other question is what does &#8220;dielectricc fill&#8221; mean in the copper layer in the layer stackup editor? &lt;br&gt;or can you provide documentation?&lt;\/p&gt;&lt;p&gt;<img decoding=\"async\" src=\"https:\/\/innovationspace.ansys.com\/forum\/wp-content\/uploads\/sites\/2\/2024\/10\/22-10-2024-1729635789-mceclip0.png\" \/>&lt;\/p&gt;&lt;\/p&gt;<\/p>\n","protected":false},"template":"","class_list":["post-390934","topic","type-topic","status-publish","hentry","topic-tag-altium","topic-tag-AnsysSiwave-1","topic-tag-siwave"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_author_ip":["212.125.15.197"],"_btv_view_count":["1291"],"_bbp_topic_status":["unanswered"],"_edit_last":["283652"],"_bbp_revision_log":["a:1:{i:391034;a:2:{s:6:\"author\";i:283652;s:6:\"reason\";s:0:\"\";}}"],"_bbp_subscription":["20363"],"_bbp_topic_id":["390934"],"_bbp_forum_id":["27793"],"_bbp_engagement":["20363","283652"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["391065"],"_bbp_last_active_id":["391065"],"_bbp_last_active_time":["2024-10-23 13:57:06"]},"test":"kagankarakusxgmail-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/390934","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":1,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/390934\/revisions"}],"predecessor-version":[{"id":391034,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/390934\/revisions\/391034"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=390934"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}