


{"id":377761,"date":"2024-08-08T23:14:48","date_gmt":"2024-08-08T23:14:48","guid":{"rendered":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/how-to-export-through-hole-via-from-hfss-layout-to-hfss\/"},"modified":"2024-08-08T23:14:48","modified_gmt":"2024-08-08T23:14:48","slug":"how-to-export-through-hole-via-from-hfss-layout-to-hfss","status":"publish","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/how-to-export-through-hole-via-from-hfss-layout-to-hfss\/","title":{"rendered":"How to export through hole via from HFSS Layout to HFSS"},"content":{"rendered":"<p>I wanted to simulate a through-hole via connecting signal trace in layer-1 to layer-6. The via properties are of right dimension in HFSS layout editor, but when I try to export it to HFSS, the via appears as solid hexagonal pillar. What setting should I change to avoid filling up of the through-hole via.<\/p>\n<p>&nbsp;<\/p>\n<p><img decoding=\"async\" src=\"https:\/\/innovationspace.ansys.com\/forum\/wp-content\/uploads\/sites\/2\/2024\/08\/08-08-2024-1723158737-mceclip0.png\"><img decoding=\"async\" src=\"https:\/\/innovationspace.ansys.com\/forum\/wp-content\/uploads\/sites\/2\/2024\/08\/08-08-2024-1723158789-mceclip1.png\"><\/p>\n","protected":false},"template":"","class_list":["post-377761","topic","type-topic","status-publish","hentry","topic-tag-ansys-help","topic-tag-ansys-hfss"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["337561","258650"],"_bbp_author_ip":["199.21.163.12"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["165"],"_bbp_topic_status":["unanswered"],"_bbp_topic_id":["377761"],"_bbp_forum_id":["27793"],"_bbp_engagement":["258650","337561"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["378028"],"_bbp_last_active_id":["378028"],"_bbp_last_active_time":["2024-08-12 21:20:54"]},"test":"varsha-ravishankarpanasonic-aero"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/377761","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/377761\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=377761"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}