{"id":372211,"date":"2024-07-16T20:57:02","date_gmt":"2024-07-16T20:57:02","guid":{"rendered":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/simultanious-co-simulation\/"},"modified":"2024-07-16T20:57:02","modified_gmt":"2024-07-16T20:57:02","slug":"simultanious-co-simulation","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/simultanious-co-simulation\/","title":{"rendered":"Simultanious co simulation"},"content":{"rendered":"<p class=\"MsoNormal\">I have &nbsp;microstrip structure integrated with lumped elements and transistors. I am doing the simulation in 3D to see the Resonance(S parametrs) without the effect of those lumped elements. Then I take this model to circuit &nbsp;model, add those lumped elements and simulate the structure in Circuit level(to see both EM and circuit element effect).<\/p>\n<p class=\"MsoNormal\">Now, I want to run the Co-simulations simultaneously. Like, I want the software to run circuit level simulations and update the results in 3D HFSS model , so its like running both 3D EM and circuit simulations) in parallel and taking the effect of both.Ideally, if they are running like that the results in circuit model and 3D should be same(as they both are taking the effect of each other).<\/p>\n<p class=\"MsoNormal\">Secondly, I wanna run parametric optimization of 3D model but I am unable to because then I was not able to see the effect of each itration togather with circuit model.<\/p>\n<p class=\"MsoNormal\">Please help me to resolve this issue and also confirms is it possible for the software to run both circuit and EM simulations together?<\/p>\n<p class=\"MsoNormal\">Thanks<\/p>\n","protected":false},"template":"","class_list":["post-372211","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["65692","109997"],"_bbp_author_ip":["128.230.210.5"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["248"],"_bbp_topic_status":["unanswered"],"_bbp_topic_id":["372211"],"_bbp_forum_id":["27793"],"_bbp_engagement":["65692","109997"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["378118"],"_bbp_last_active_id":["378118"],"_bbp_last_active_time":["2024-08-13 12:47:39"]},"test":"jaslamsyr-edu"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/372211","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/372211\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=372211"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}