{"id":369830,"date":"2024-06-04T17:03:38","date_gmt":"2024-06-04T17:03:38","guid":{"rendered":"\/forum\/forums\/topic\/thermal-network-and-other-thermal-features-for-pcb-components\/"},"modified":"2024-06-04T17:03:38","modified_gmt":"2024-06-04T17:03:38","slug":"thermal-network-and-other-thermal-features-for-pcb-components","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/thermal-network-and-other-thermal-features-for-pcb-components\/","title":{"rendered":"Thermal Network and other Thermal features for PCB Components"},"content":{"rendered":"

Hello,<\/p>\n

I’m attempting to set up a steady-state thermal sim for a single board computer design. I’m coming from different software, so I am unfamiliar with setting things up properly in icepak (but verry happy to be using it now). I’ve got the board design imported and trace mapped, and I am attempting to set up all of the heat dissipators. I started out by using a Block component and setting the power for each component. I then attempted to set a thermal resistance at the bottom face of each component, but I’ve found that that is not an option. <\/p>\n

So now I’m using a 1R thermal network. Is this the best option for this case? This is an application for space, so I do not have any convection to deal with, and I am ignoring radiative heat transfer for the time being. So I set up the Network with the power dissipated for the internal node and Theta_jb for the internal resistance. First, I got an error stating that the face has mesh on both sides. That seemed odd to me, but it sounds like I need to deselect “Solve Inside” to force it to mesh a shell rather than a solid body? After doing that, it did mesh. <\/p>\n

Some questions:<\/p>\n

    \n
  1. Is using a 1R thermal network the best way to simply model these components? I saw some example files that used a Thermal Block for PCB components — how would one go about modeling the thermal resistance when using a Block rather than a Network?<\/li>\n
  2. This PCBA uses wedge locks to secure it in the chassis (3U SpaceVPX module). The wedge locks land on the frame\/stiffener of the PCBA module on bottom, and on the chassis on top. The manufacturer specifies a thermal resistance across them, so my understanding is that I should use a 1R Thermal Network with the top and bottom faces (again, modeling this part as a shell) — does that seem correct, or is there a better thermal feature to use?<\/li>\n
  3. I also have some thin AL shims on the opposite side of the PCB from the wedge locks. They are ~0.5mm thick, and they are bonded to the PCB with die attach film adhesive. Which thermal component type do you recommend for modeling the thermal resistance of the adhesive? I do know the thermal conductivity and thickness of the adhesive, so would you recommend a Plate feature?<\/li>\n
  4. Is there not a way to simply add a thermal resistance at the interface of two bodies?<\/li>\n<\/ol>\n

    Thank you in advance for any help, and forgive me for the extreme noobie questions.<\/p>\n

    Below is how I’ve set up the 1R Network.<\/p>\n

    <\/p>\n","protected":false},"template":"","class_list":["post-369830","topic","type-topic","status-closed","hentry","topic-tag-AEDTICEPAK-1","topic-tag-thermal-network","topic-tag-thermal-resistance-1","topic-tag-trace-mapping-1"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["85792","2688"],"_bbp_author_ip":["184.24.96.177"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["1057"],"_bbp_topic_status":["unanswered"],"_bbp_topic_id":["369830"],"_bbp_forum_id":["27793"],"_bbp_engagement":["2688","85792"],"_bbp_voice_count":["2"],"_bbp_reply_count":["1"],"_bbp_last_reply_id":["372158"],"_bbp_last_active_id":["372158"],"_bbp_last_active_time":["2024-07-16 15:15:02"]},"test":"jordan-jonespowerdevicecorp-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/369830","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/369830\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=369830"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}