{"id":367745,"date":"2024-05-21T06:53:51","date_gmt":"2024-05-21T06:53:51","guid":{"rendered":"\/forum\/forums\/topic\/fdtd-model-for-interconnect-element\/"},"modified":"2024-05-21T06:58:55","modified_gmt":"2024-05-21T06:58:55","slug":"fdtd-model-for-interconnect-element","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/fdtd-model-for-interconnect-element\/","title":{"rendered":"FDTD Model for Interconnect Element"},"content":{"rendered":"

We need guidance regarding the exporting a multi-input (say 3) and multi-output (say 2) port structure from FDTD simulations to use in Interconnect as one of element. Specifically, we require assistance ensuring that the imported FDTD model in Interconnect seamlessly integrates with the control of exported structure internal properties (internal physics), such as geometry changes (say change in port width), which will also incorporate the corresponding results (say transmittance).<\/p>\n

Below are possible approaches I thought of:<\/p>\n

<\/a>  OR <\/a><\/p>\n

Please advise which approach is correct to get S-parameters that can be used in Interconnect. If both are wrong, please guide, how it can be done.<\/p>\n

It would be great if you can refer some of the contet for this as well as, scripting to extract S-parameters for above case.<\/p>\n

Thank you.<\/p>\n","protected":false},"template":"","class_list":["post-367745","topic","type-topic","status-closed","hentry","topic-tag-3DFDTD-1","topic-tag-interconnect","topic-tag-LumericalFDTD-1","topic-tag-portsetup-1"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["90277","185544"],"_bbp_author_ip":["184.24.96.207"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["489"],"_bbp_topic_status":["unanswered"],"_edit_lock":["1716274591:309782"],"_bbp_topic_id":["367745"],"_bbp_forum_id":["27833"],"_bbp_engagement":["90277","185544"],"_bbp_voice_count":["2"],"_bbp_reply_count":["5"],"_bbp_last_reply_id":["368574"],"_bbp_last_active_id":["368574"],"_bbp_last_active_time":["2024-05-24 21:45:31"]},"test":"opz228317iitd-ac-in"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/367745","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":5,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/367745\/revisions"}],"predecessor-version":[{"id":367752,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/367745\/revisions\/367752"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=367745"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}