{"id":364144,"date":"2024-04-25T10:13:54","date_gmt":"2024-04-25T10:13:54","guid":{"rendered":"\/forum\/forums\/topic\/stress-due-to-thermal-expansion\/"},"modified":"2024-04-25T10:13:54","modified_gmt":"2024-04-25T10:13:54","slug":"stress-due-to-thermal-expansion","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/stress-due-to-thermal-expansion\/","title":{"rendered":"Stress due to thermal expansion"},"content":{"rendered":"<p>Hello all.<\/p>\n<p>I need to simulate stresses in a rectangular glass slab during cooling from a high temperature. As the conductivity of glass slab is low, stresses will be generated due to non linear thermal expansion within the glass slab even though it is free to expand from everywhere. The problem is that I am unable to apply boundry condition in which I can specify that the slab is free to expand from everywhere. I am trying to do it, but it is giving me pivotal error. Please let me know how to define such boundary condition.<\/p>\n<p>&nbsp;<\/p>\n<p>Second thing is, is it possible to calculate what could be the heat transfer coefficient on the surfaces of the slab just by giving geometry and temperature ( and material also).<\/p>\n<p>P.S. Heat is convected from each surface and slab if free to move in each direction. Also the problem is of transient thermal.<\/p>\n<p>&nbsp;<\/p>\n<p>Thanks in advance!&nbsp;<\/p>\n","protected":false},"template":"","class_list":["post-364144","topic","type-topic","status-closed","hentry","topic-tag-ansys-transient-thermal-2","topic-tag-SOLVERPIVOTERROR-1","topic-tag-thermal-stress-1"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["342795","240","341850"],"_bbp_author_ip":["23.206.193.59"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["713"],"_bbp_topic_status":["unanswered"],"_bbp_topic_id":["364144"],"_bbp_forum_id":["27784"],"_bbp_engagement":["240","341850","342795"],"_bbp_voice_count":["3"],"_bbp_reply_count":["2"],"_bbp_last_reply_id":["365409"],"_bbp_last_active_id":["365409"],"_bbp_last_active_time":["2024-05-03 12:44:45"]},"test":"vvaibhav1002gmail-com"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/364144","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/364144\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=364144"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}