{"id":359209,"date":"2024-03-27T04:39:06","date_gmt":"2024-03-27T04:39:06","guid":{"rendered":"\/forum\/forums\/topic\/bulge-test-simulation-using-ansys\/"},"modified":"2024-03-27T04:39:06","modified_gmt":"2024-03-27T04:39:06","slug":"bulge-test-simulation-using-ansys","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/bulge-test-simulation-using-ansys\/","title":{"rendered":"Bulge test simulation using ansys"},"content":{"rendered":"

I’m trying to simulation the thin film bulge test.<\/p>\n

My goals are calculate the residual stress, maximum stress, fracture stress.<\/p>\n

Now, I want to reproduce the paper result ‘microelectronics: Design, Technology, and Packaging III. SPIE, p. 337-344, 2007’<\/p>\n

1. My problem is i don’t know how to insert the residual stress in the film for initial condition<\/p>\n

2. Since our sample is suspended membrane on substrate, maybe delamination will occur at the edge of contact region. So, I want to know what kind of contact condition is good for our simulation. <\/p>\n

3. Maybe I can use the fracture condition to check the delamination at the edge. but I’m not familiar with the program, I don’t know what condition will be fitted for our simulation.<\/p>\n

Thank you for your help.<\/p>\n","protected":false},"template":"","class_list":["post-359209","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t