{"id":359209,"date":"2024-03-27T04:39:06","date_gmt":"2024-03-27T04:39:06","guid":{"rendered":"\/forum\/forums\/topic\/bulge-test-simulation-using-ansys\/"},"modified":"2024-03-27T04:39:06","modified_gmt":"2024-03-27T04:39:06","slug":"bulge-test-simulation-using-ansys","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/bulge-test-simulation-using-ansys\/","title":{"rendered":"Bulge test simulation using ansys"},"content":{"rendered":"<p>I&#8217;m trying to simulation the thin film bulge test.<\/p>\n<p>My goals are calculate the residual stress, maximum stress, fracture stress.<\/p>\n<p>Now, I want to reproduce the paper result &#8216;microelectronics: Design, Technology, and Packaging III. SPIE, p. 337-344, 2007&#8217;<\/p>\n<p>1. My problem is i don&#8217;t know how to insert the residual stress in the film for initial condition<\/p>\n<p>2. Since our sample is suspended membrane on substrate, maybe delamination will occur at the edge of contact region. So, I want to know what kind of contact condition is good for our simulation.&nbsp;<\/p>\n<p>3. Maybe I can use the fracture condition to check the delamination at the edge. but I&#8217;m not familiar with the program, I don&#8217;t know what condition will be fitted for our simulation.<\/p>\n<p>Thank you for your help.<\/p>\n","protected":false},"template":"","class_list":["post-359209","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["74546","88"],"_bbp_author_ip":["23.206.193.59"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["128"],"_bbp_topic_status":["unanswered"],"_bbp_topic_id":["359209"],"_bbp_forum_id":["27791"],"_bbp_engagement":["88","74546"],"_bbp_voice_count":["2"],"_bbp_reply_count":["2"],"_bbp_last_reply_id":["359352"],"_bbp_last_active_id":["359352"],"_bbp_last_active_time":["2024-03-28 00:45:24"]},"test":"wmr1204skku-edu"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/359209","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/359209\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=359209"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}