{"id":357504,"date":"2024-03-18T01:09:25","date_gmt":"2024-03-18T01:09:25","guid":{"rendered":"\/forum\/forums\/topic\/simulation-of-bonding-two-polymer-plates\/"},"modified":"2024-03-19T13:33:38","modified_gmt":"2024-03-19T13:33:38","slug":"simulation-of-bonding-two-polymer-plates","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/simulation-of-bonding-two-polymer-plates\/","title":{"rendered":"Simulation of bonding two polymer plates"},"content":{"rendered":"<p>Hi. I wanted to do the simulation of bonding two small polymer plates by heating the plates near the glass transition temperature and applying external pressure from all sides. The simulation also need to show air bubbles entrapped between the bonding interfaces because of insufficient applied pressure. Is it possible to do this simulation in ansys? Any suggestions would be highly appreciated. Thanks.<a class=\"wp-colorbox-image cboxElement\" href=\"\/forum\/wp-content\/uploads\/sites\/2\/2024\/03\/18-03-2024-1710724142-bonding of polymer.JPG\"><img decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2024\/03\/18-03-2024-1710724142-bonding of polymer.JPG\" alt=\"\"><\/a><\/p>\n","protected":false},"template":"","class_list":["post-357504","topic","type-topic","status-closed","hentry","topic-tag-ansys-thermal-1","topic-tag-polymers-1"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Hi. I wanted to do the simulation of bonding two small polymer plates by heating the plates near the glass transition temperature and applying external pressure from all sides. The simulation also need to show air bubbles entrapped between the bonding interfaces because of insufficient applied pressure. 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I wanted to do the simulation of bonding two small polymer plates by heating the plates near the glass transition temperature and applying external pressure from all sides. The simulation also need to show air bubbles entrapped between the bonding interfaces because of insufficient applied pressure. 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