{"id":354919,"date":"2024-03-02T05:26:02","date_gmt":"2024-03-02T05:26:02","guid":{"rendered":"\/forum\/forums\/topic\/frictional-vibrations-in-the-wafer-surface-cleaning-process\/"},"modified":"2024-03-02T05:26:02","modified_gmt":"2024-03-02T05:26:02","slug":"frictional-vibrations-in-the-wafer-surface-cleaning-process","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/frictional-vibrations-in-the-wafer-surface-cleaning-process\/","title":{"rendered":"Frictional vibrations in the wafer surface cleaning process."},"content":{"rendered":"
Dear Guys, nI am trying to simulation of Below are the simulation settings for the grinding part and the questions I would like to inquire about, thank you~~<\/div>\n
 <\/div>\n
Simulation Settings:<\/div>\n
 <\/div>\n
Grinding Wheel: Speed: 2200 rpm, Wafer Speed: -250 rpm, Distance between grinding wheel and wafer surface: 11.023mm, The pencil arm rotates 90 degrees from the origin when it contacts the wafer surface.<\/div>\n
Currently, the number of substeps is set to 200. The grinding wheel and wafer reach the target speed at step 90, the grinding wheel contacts the wafer surface at step 91, and the pencil arm starts rotating from 0 to 90 degrees at step 92.<\/div>\n
Contact Settings: Rotational parts are set using a revolute joint, and other contacts use bonded contacts. Frictional contact between the grinding wheel and wafer surface uses friction contact with a coefficient of friction set to 0.1.<\/div>\n
Weak spring and large deflection settings are enabled in the simulation.<\/div>\n
Rotation of the wafer and grinding wheel is set using rotation velocity; rotation and downward displacement of the pencil arm are set using joint load.<\/div>\n
Issues:<\/div>\n
 <\/div>\n
Before optimizing the wafer mesh, severe deformation and detachment of the support frame contact were observed when the process frame at the bottom of the wafer rotated. Substep numbers have been adjusted, and contact settings have been set to bonded, but the issue still persists.<\/div>\n
When only setting the displacement of the pencil arm downward by 11.023, deformation occurs before the grinding wheel contacts the wafer.<\/div>\n
After optimizing the wafer mesh, the wafer is divided into 5 parts, and it seems that strain does not propagate to the middle square section.<\/div>\n
In order to optimize the wafer mesh, during the cutting process, the support frame underneath is cut into. How can this be improved?<\/div>\n
 <\/div>\n
 <\/div>\n
 <\/div>\n
Thanks if anyone can help solve this.<\/div>\n

\"\"
\"\"<\/p>\n

\"\"<\/p>\n

\"\"<\/p>\n

\"\"<\/p>\n","protected":false},"template":"","class_list":["post-354919","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t\n\t\n\t\n\t\n\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t\n\t\t