{"id":343339,"date":"2024-01-05T09:21:57","date_gmt":"2024-01-05T09:21:57","guid":{"rendered":"\/forum\/forums\/topic\/stress-analysis-at-200-hz\/"},"modified":"2024-01-12T10:50:49","modified_gmt":"2024-01-12T10:50:49","slug":"stress-analysis-at-200-hz","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/stress-analysis-at-200-hz\/","title":{"rendered":"Stress Analysis at 200 Hz"},"content":{"rendered":"<p>Dear all,&nbsp;<\/p>\n<p>I am performing transient simulation on the system shown below. Here, item 1 and 3 are glue together with adhesive. So, i have applied bonded contact with MPC formulation between item 1 and 2, and between item 2 and 3. All the items are modeled as linear elastic materials (Young modulus item 1: 44 GPa, item 2: 2 GPa, item 3: 193 GPa). One of the input boundary conditions is a displacement controlled loading (represented by arrow in Z direction) and shown below (right image). I can vary the frequency, by changing the time for one cycle. Currently it represents 200 Hz (1\/.005s).<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2024\/01\/05-01-2024-1704446067-mceclip0.png\" width=\"406\" height=\"180\"><img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2024\/01\/05-01-2024-1704446127-mceclip2.png\" width=\"421\" height=\"244\"><\/p>\n<p>I expected to see similar displacement output for Item 3, however there is a high rippling effect as I have shown in the deformation plot below. This didn&#8217;t occur at lower frequency for instance 100 Hz. Could anyone advise how to rectify this? Thank you.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2024\/01\/05-01-2024-1704446241-mceclip3.png\" width=\"432\" height=\"220\"><\/p>\n","protected":false},"template":"","class_list":["post-343339","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Dear all, I am performing transient simulation on the system shown below. Here, item 1 and 3 are glue together with adhesive. So, i have applied bonded contact with MPC formulation between item 1 and 2, and between item 2 and 3. 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