{"id":338651,"date":"2023-12-15T03:23:20","date_gmt":"2023-12-15T03:23:20","guid":{"rendered":"\/forum\/forums\/topic\/study-for-damping-effect-of-adhesive-in-ansys\/"},"modified":"2023-12-15T03:23:20","modified_gmt":"2023-12-15T03:23:20","slug":"study-for-damping-effect-of-adhesive-in-ansys","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/study-for-damping-effect-of-adhesive-in-ansys\/","title":{"rendered":"study for damping effect of adhesive in ansys"},"content":{"rendered":"<p>Hi all,<\/p>\n<p>I am tring to study the effect of damping properties of epoxy adhesive on the output motion of the moving component from low to high frequencies (up to 800 Hz). This adhesive (~1 to 2 mm thick) sticks the energy supplying element to the moving component as shown below.<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/12\/15-12-2023-1702610258-mceclip1.png\" width=\"444\" height=\"119\"><\/p>\n<p>I have modelled in transient module of ansys currently as shown below, where the input load is supplied as a displacement controlled boundary condition (hence haven&#8217;t modeled the energy supplying element).&nbsp;<\/p>\n<p>My question is what would be the correct approach to study the damping effect of epoxy on the moving component&#8217;s output motion ?<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" src=\"\/forum\/wp-content\/uploads\/sites\/2\/2023\/12\/15-12-2023-1702610427-mceclip2.png\" width=\"502\" height=\"127\"><\/p>\n<p>Thanks.<\/p>\n","protected":false},"template":"","class_list":["post-338651","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_subscription":["21014","240"],"_bbp_author_ip":["23.52.43.81"]," _bbp_last_reply_id":["0"]," _bbp_likes_count":["0"],"_btv_view_count":["319"],"_bbp_topic_status":["unanswered"],"_edit_lock":["1702610780:198429"],"_bbp_status":["publish"],"_bbp_topic_id":["338651"],"_bbp_forum_id":["27791"],"_bbp_engagement":["240","21014"],"_bbp_voice_count":["2"],"_bbp_reply_count":["7"],"_bbp_last_reply_id":["339443"],"_bbp_last_active_id":["339443"],"_bbp_last_active_time":["2023-12-20 02:28:35"]},"test":"pranshu-kharbandantu-edu-sg"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/338651","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/338651\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=338651"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}