{"id":33240,"date":"2019-02-12T10:07:00","date_gmt":"2019-02-12T10:07:00","guid":{"rendered":"\/forum\/forums\/topic\/electronical-and-thermal-analysis\/"},"modified":"2019-02-12T10:07:00","modified_gmt":"2019-02-12T10:07:00","slug":"electronical-and-thermal-analysis","status":"closed","type":"topic","link":"https:\/\/innovationspace.ansys.com\/forum\/forums\/topic\/electronical-and-thermal-analysis\/","title":{"rendered":"Electronical and thermal analysis"},"content":{"rendered":"<p>Hello everyone,<\/p>\n<p><\/p>\n<p>I have to do the following simulation:<\/p>\n<p><\/p>\n<p>Heating source is a copper conductor path with an aplied voltage. This is &#8220;printed&#8221; on the surface of a substrate.<\/p>\n<p><\/p>\n<p>I want to know how long it takes, to heat the substrate, which electricity is needed an how long it takes until the substrate is cooled down again.<\/p>\n<p><\/p>\n<p>Boundary conditions are heat transfer in the sustrate, convection and thermal radiation on the surface of the substrate. And the voltage on the conductor path.&nbsp;<\/p>\n<p><\/p>\n<p>Which tool can I use for this case?<\/p>\n<p><\/p>\n<p>Thanks a lot in advance.<\/p>\n","protected":false},"template":"","class_list":["post-33240","topic","type-topic","status-closed","hentry"],"aioseo_notices":[],"acf":[],"custom_fields":[{"0":{"_bbp_old_topic_id":["5412"],"_bbp_old_topic_author_name_id":["Anonymous"],"_bbp_old_is_topic_anonymous_id":["false"],"_bbp_old_closed_status_id":["publish"],"_bbp_author_ip":[null],"_bbp_old_sticky_status_id":["normal"],"_bbp_likes_count":["0","0","0","0","0"],"_btv_view_count":["2125"],"_bbp_topic_status":["unanswered"],"_bbp_status":["publish"],"_bbp_topic_id":["33240"],"_bbp_forum_id":["27793"],"_bbp_engagement":["240","160648","161910","223802","230084"],"_bbp_voice_count":["5"],"_bbp_reply_count":["12"],"_bbp_last_reply_id":["224880"],"_bbp_last_active_id":["224880"],"_bbp_last_active_time":["2021-09-29 10:08:35"]},"test":"ranked"}],"_links":{"self":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/33240","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics"}],"about":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/types\/topic"}],"version-history":[{"count":0,"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/topics\/33240\/revisions"}],"wp:attachment":[{"href":"https:\/\/innovationspace.ansys.com\/forum\/wp-json\/wp\/v2\/media?parent=33240"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}